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BM60213FV-CE2
Integrated Circuits (ICs)

BM60213FV-CE2

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Rohm Semiconductor

1200 V HIGH VOLTAGE HIGH AND LOW SIDE DRIVER

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BM60213FV-CE2
Integrated Circuits (ICs)

BM60213FV-CE2

Active
Rohm Semiconductor

1200 V HIGH VOLTAGE HIGH AND LOW SIDE DRIVER

Technical Specifications

Parameters and characteristics for this part

SpecificationBM60213FV-CE2
Channel TypeIndependent
Current - Peak Output (Source, Sink) [custom]3.9 A
Current - Peak Output (Source, Sink) [custom]4.5 A
Driven ConfigurationHigh-Side or Low-Side
Gate TypeIGBT, MOSFET (N-Channel)
GradeAutomotive
High Side Voltage - Max (Bootstrap) [Max]1.2 kV
Input TypeNon-Inverting
Logic Voltage - VIL, VIH0.8 V, 2 V
Mounting TypeSurface Mount
Number of Drivers2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Package / Case0.24 "
Package / Case20-SSOP
Package / Case [y]6.1 mm
QualificationAEC-Q100
Rise / Fall Time (Typ) [custom]50 ns
Rise / Fall Time (Typ) [custom]50 ns
Supplier Device Package20-SSOP-BW
Voltage - Supply [Max]24 V
Voltage - Supply [Min]10 VDC

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1850$ 4.72

Description

General part information

BM60213FV-C Series

The BM60213FV-C is high and low side drive IC which operates up to 1200 V with bootstrap operation, which can drive N-channel power MOSFET and IGBT. Under-voltage Lockout (UVLO) function is built-in.

Documents

Technical documentation and resources

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

BM60213FV-C Spice Modeling Report

Models

Gate Driver BM60213FV-C Evaluation Board BM60213FV-EVK001

User's Guide

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

PCB Layout Thermal Design Guide

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use the Two-Resistor Model

Thermal Design

Five Steps for Successful Thermal Design of IC

White Paper

What Is Thermal Design

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Thermal Resistance

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

BM60213FV-C Data Sheet

Data Sheet

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

Factory Information

Manufacturing Data

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

SSOP-B20W Package Information

Package Information