Integrated Circuits (ICs)

LPV358IDDUR

Obsolete

Texas Instruments

IC OPAMP GP 2 CIRCUIT 8VSSOP

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Integrated Circuits (ICs)

LPV358IDDUR

Obsolete

Texas Instruments

IC OPAMP GP 2 CIRCUIT 8VSSOP

Deep-Dive with AI

DocumentsDatasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	LPV358IDDUR

Amplifier Type	General Purpose
Current - Input Bias	2 nA
Current - Output / Channel	72 mA
Current - Supply	15 µA
Gain Bandwidth Product	237 kHz
Mounting Type	Surface Mount
Number of Circuits	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Output Type	Rail-to-Rail
Package / Case	8-VFSOP
Package / Case [y]	2.3 mm
Package / Case [y]	0.091 in
Slew Rate	0.1 V/µs
Voltage - Input Offset	1.5 mV
Voltage - Supply Span (Max) [Max]	5 V
Voltage - Supply Span (Min) [Min]	2.7 V

LPV358-N Series

Dual, 5-V, 152-kHz, low quiescent current (7-μA), RRO operational amplifier

Part	Current - Output / Channel	Voltage - Supply Span (Min) [Min]	Slew Rate	Voltage - Supply Span (Max) [Max]	Package / Case	Package / Case [custom]	Package / Case	Gain Bandwidth Product	Current - Input Bias	Mounting Type	Output Type	Amplifier Type	Number of Circuits	Voltage - Input Offset	Current - Supply	Operating Temperature [Max]	Operating Temperature [Min]	Package / Case [y]	Package / Case [y]	Package / Case [x]	Supplier Device Package
Texas Instruments LPV358MM	16 mA	2.7 V	0.1 V/µs	5 V	8-MSOP 8-TSSOP	0.118 in	3 mm	152 kHz	2 nA	Surface Mount	Rail-to-Rail	General Purpose	2	1.5 mV	15 µA	85 °C	-40 °C
Texas Instruments LPV358DDURE4	72 mA	2.7 V	0.1 V/µs	5 V	8-VFSOP			237 kHz	2 nA	Surface Mount	Rail-to-Rail	General Purpose	2	1.5 mV	15 µA	85 °C	-40 °C	2.3 mm	0.091 in
Texas Instruments LPV358IDGKRG4	72 mA	2.7 V	0.1 V/µs	5 V	8-MSOP 8-TSSOP	0.118 in	3 mm	237 kHz	2 nA	Surface Mount	Rail-to-Rail	General Purpose	2	1.5 mV	15 µA	125 °C	-40 °C
Texas Instruments LPV358IDR	72 mA	2.7 V	0.1 V/µs	5 V	8-SOIC			237 kHz	2 nA	Surface Mount	Rail-to-Rail	General Purpose	2	1.5 mV	15 µA	125 °C	-40 °C		3.9 mm	0.154 in	8-SOIC
Texas Instruments LPV358DG4	72 mA	2.7 V	0.1 V/µs	5 V	8-SOIC			237 kHz	2 nA	Surface Mount	Rail-to-Rail	General Purpose	2	1.5 mV	15 µA	85 °C	-40 °C		3.9 mm	0.154 in	8-SOIC
Texas Instruments LPV358DR	72 mA	2.7 V	0.1 V/µs	5 V	8-SOIC			237 kHz	2 nA	Surface Mount	Rail-to-Rail	General Purpose	2	1.5 mV	15 µA	85 °C	-40 °C		3.9 mm	0.154 in	8-SOIC
Texas Instruments LPV358IDRG4	72 mA	2.7 V	0.1 V/µs	5 V	8-SOIC			237 kHz	2 nA	Surface Mount	Rail-to-Rail	General Purpose	2	1.5 mV	15 µA	125 °C	-40 °C		3.9 mm	0.154 in	8-SOIC
Texas Instruments LPV358MMX/NOPB	16 mA	2.7 V	0.1 V/µs	5 V	8-MSOP 8-TSSOP	0.118 in	3 mm	152 kHz	2 nA	Surface Mount	Rail-to-Rail	General Purpose	2	1.5 mV	15 µA	85 °C	-40 °C
Texas Instruments LPV358IDDUR	72 mA	2.7 V	0.1 V/µs	5 V	8-VFSOP			237 kHz	2 nA	Surface Mount	Rail-to-Rail	General Purpose	2	1.5 mV	15 µA	125 °C	-40 °C	2.3 mm	0.091 in
Texas Instruments LPV358DGKR	72 mA	2.7 V	0.1 V/µs	5 V	8-MSOP 8-TSSOP	0.118 in	3 mm	237 kHz	2 nA	Surface Mount	Rail-to-Rail	General Purpose	2	1.5 mV	15 µA	85 °C	-40 °C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

LPV358-N Series

The LPV3xx-N are low power (9-µA per channel at 5 V) versions of the LMV3xx op amps. This is another addition to the LMV family of commodity op amps.

The LPV3xx-N are the most cost effective solutions for the applications where low voltage, low power operation, space saving and low price are needed. The LPV3xx-N have rail-to-rail output swing capability and the input common-mode voltage range includes ground. They all exhibit excellent speed-power ratio, achieving 152 kHz of bandwidth with a supply current of only 9 µA.

The LPV321-N is available in space saving 5-Pin SC70, which is approximately half the size of 5-Pin SOT-23. The small package saves space on PC boards, and enables the design of small portable electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity.

Documents

Technical documentation and resources