
Deep-Dive with AI
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Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | 5CSEMA6F31A7N |
|---|---|
| Architecture | FPGA, MCU |
| Connectivity | CANbus, SPI, I2C, UART/USART, MMC/SD/SDIO, Ethernet, EBI/EMI, USB OTG |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Grade | Automotive |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 C |
| Package / Case | 896-BGA |
| Peripherals | POR, WDT, DMA |
| Primary Attributes | 110K Logic Elements |
| Qualification | AEC-Q100 |
| RAM Size | 64 KB |
| Speed | 700 MHz |
| Supplier Device Package | 896-FBGA |
| Supplier Device Package [x] | 31 |
| Supplier Device Package [y] | 31 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 460.32 | |
| 0 | $ 460.32 | |||
| Tray | 27 | $ 430.21 | ||
| 27 | $ 430.21 | |||
Description
General part information
5CSEMA6 Series
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SE FPGA - 110K Logic Elements 700MHz 896-FBGA (31x31)
Documents
Technical documentation and resources