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Discrete Semiconductor Products

RGT40NL65DGTL

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Rohm Semiconductor

IGBTS RGT40NL65D IS A FIELD STOP TRENCH IGBT WITH LOW COLLECTOR - EMITTER SATURATION VOLTAGE, SUITABLE FOR GENERAL INVERTER, UPS, POWER CONDITIONER, WELDER.

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Discrete Semiconductor Products

RGT40NL65DGTL

Active
Rohm Semiconductor

IGBTS RGT40NL65D IS A FIELD STOP TRENCH IGBT WITH LOW COLLECTOR - EMITTER SATURATION VOLTAGE, SUITABLE FOR GENERAL INVERTER, UPS, POWER CONDITIONER, WELDER.

Technical Specifications

Parameters and characteristics for this part

SpecificationRGT40NL65DGTL
Current - Collector (Ic) (Max) [Max]40 A
Current - Collector Pulsed (Icm)60 A
Gate Charge40 nC
IGBT TypeTrench Field Stop
Mounting TypeSurface Mount
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
Power - Max [Max]161 W
Reverse Recovery Time (trr)58 ns
Supplier Device PackageLPDS
Td (on/off) @ 25°C [custom]22 ns
Td (on/off) @ 25°C [custom]75 ns
Test Condition20 A, 10 Ohm, 400 V, 15 V
Vce(on) (Max) @ Vge, Ic2.1 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2034$ 4.18
MouserN/A 1$ 3.07
10$ 2.42
100$ 1.77
500$ 1.50
1000$ 1.43

Description

General part information

RGT40NL65D Series

RGT40NL65D is a Field Stop Trench IGBT with low collector - emitter saturation voltage, suitable for General Inverter, UPS, Power Conditioner, Welder.

Documents

Technical documentation and resources

RGT40NL65DGTL Datasheet (PDF)

Datasheet

About Export Administration Regulations (EAR)

Export Information

Types and Features of Transistors

Application Note

What is a Thermal Model? (IGBT)

Thermal Design

Part Explanation

Application Note

Package Dimensions

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Compliance of the ELV directive

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

Moisture Sensitivity Level

Package Information

How to Create Symbols for PSpice Models

Models

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

What Is Thermal Design

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Anti-Whisker formation

Package Information

About Flammability of Materials

Environmental Data