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AG501EGD3HRBTL
Discrete Semiconductor Products

AG501EGD3HRBTL

Active
Rohm Semiconductor

PCH -40V -80A, TO-252 (DPAK), POWER MOSFET FOR AUTOMOTIVE

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AG501EGD3HRBTL
Discrete Semiconductor Products

AG501EGD3HRBTL

Active
Rohm Semiconductor

PCH -40V -80A, TO-252 (DPAK), POWER MOSFET FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationAG501EGD3HRBTL
Drain to Source Voltage (Vdss)40 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]145 nC
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds [Max]7350 pF
Mounting TypeSurface Mount
Operating Temperature175 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)142 W
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs [Max]4.9 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max) [Max]5 V, -20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2490$ 3.45

Description

General part information

AG501EGD3HRB Series

AG501EGD3HRB is an automotive grade MOSFET that is AEC-Q101 qualified. Ideal for Automotive Systems

Documents

Technical documentation and resources

PCB Layout Thermal Design Guide

Thermal Design

Explanation for Marking

Package Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

About Flammability of Materials

Environmental Data

Types and Features of Transistors

Application Note

AG501EGD3HRB ESD Data

Characteristics Data

About Export Regulations

Export Information

List of Transistor Package Thermal Resistance

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

AG501EGD3HRB Data Sheet

Data Sheet

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Part Explanation

Application Note

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Anti-Whisker formation - Transistors

Package Information

TO-252_TL Taping Information

Package Information

Compliance of the RoHS directive

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Package Dimensions

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Moisture Sensitivity Level - Transistors

Package Information