Zenode.ai Logo
Beta
Product schematic image
Discrete Semiconductor Products

RUR040N02TL

Active
Rohm Semiconductor

POWER MOSFET, N CHANNEL, 20 V, 4 A, 0.025 OHM, TSMT, SURFACE MOUNT

Deep-Dive with AI

Search across all available documentation for this part.

Product schematic image
Discrete Semiconductor Products

RUR040N02TL

Active
Rohm Semiconductor

POWER MOSFET, N CHANNEL, 20 V, 4 A, 0.025 OHM, TSMT, SURFACE MOUNT

Technical Specifications

Parameters and characteristics for this part

SpecificationRUR040N02TL
Current - Continuous Drain (Id) @ 25°C4 A
Drain to Source Voltage (Vdss)20 V
Drive Voltage (Max Rds On, Min Rds On)1.5 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs8 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]680 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-96
Power Dissipation (Max)1 W
Rds On (Max) @ Id, Vgs35 mOhm
Supplier Device PackageTSMT3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)10 V
Vgs(th) (Max) @ Id1.3 V

RUR040N02 Series

Nch 20V 4A Small Signal MOSFET

PartMounting TypeVgs (Max)TechnologyInput Capacitance (Ciss) (Max) @ Vds [Max]Current - Continuous Drain (Id) @ 25°CFET TypeVgs(th) (Max) @ IdGate Charge (Qg) (Max) @ VgsRds On (Max) @ Id, VgsDrive Voltage (Max Rds On, Min Rds On)Power Dissipation (Max)Drain to Source Voltage (Vdss)Operating TemperatureSupplier Device PackagePackage / Case
Product schematic image
Rohm Semiconductor
Surface Mount
10 V
MOSFET (Metal Oxide)
680 pF
4 A
N-Channel
1.3 V
8 nC
35 mOhm
1.5 V
4.5 V
1 W
20 V
150 °C
TSMT3
SC-96

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 14046$ 0.97
NewarkEach (Supplied on Cut Tape) 1$ 0.89
10$ 0.67
25$ 0.59
50$ 0.52
100$ 0.44
250$ 0.39
500$ 0.35
1000$ 0.31

Description

General part information

RUR040N02 Series

Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

Types and Features of Transistors

Application Note

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

ESD Data

Characteristics Data

Moisture Sensitivity Level - Transistors

Package Information

About Flammability of Materials

Environmental Data

About Export Regulations

Export Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Reliability Test Result

Manufacturing Data

Inner Structure

Package Information

What Is Thermal Design

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Taping Information

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Package Dimensions

Package Information

RUR040N02 Data Sheet

Data Sheet

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Part Explanation

Application Note

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Create Symbols for PSpice Models

Models

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Compliance of the RoHS directive

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Explanation for Marking

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Technical Data Sheet EN

Datasheet