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ROHM RF4G060ATTCR
Discrete Semiconductor Products

RF4G100BGTCR

Active
Rohm Semiconductor

MOSFET, N-CH, 40V, 2W, DFN2020, 8PIN ROHS COMPLIANT: YES

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ROHM RF4G060ATTCR
Discrete Semiconductor Products

RF4G100BGTCR

Active
Rohm Semiconductor

MOSFET, N-CH, 40V, 2W, DFN2020, 8PIN ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRF4G100BGTCR
Current - Continuous Drain (Id) @ 25°C10 A
Drain to Source Voltage (Vdss)40 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]10.6 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]530 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerUDFN
Power Dissipation (Max)2 W
Rds On (Max) @ Id, Vgs [Max]14.2 mOhm
Supplier Device PackageDFN2020-8S
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1477$ 1.37
NewarkEach (Supplied on Cut Tape) 1$ 1.55
10$ 1.03
25$ 0.92
50$ 0.81
100$ 0.70
250$ 0.63
500$ 0.56
1000$ 0.51

Description

General part information

RF4G100BG Series

RF4G100BG is a power MOSFET with low on - resistance, suitable for switching.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Taping Information

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Package Dimensions

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Part Explanation

Application Note

Explanation for Marking

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Types and Features of Transistors

Application Note

How to Use LTspice® Models

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

RF4G100BG ESD Data

Characteristics Data

What is a Thermal Model? (Transistor)

Thermal Design

Inner Structure

Package Information

Compliance of the RoHS directive

Environmental Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

About Export Regulations

Export Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design