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Integrated Circuits (ICs)

BD8374EFJ-ME2

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Rohm Semiconductor

50V 500MA 1-CHANNEL LED SOURCE DRIVER FOR AUTOMOTIVE

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Product dimension image
Integrated Circuits (ICs)

BD8374EFJ-ME2

Active
Rohm Semiconductor

50V 500MA 1-CHANNEL LED SOURCE DRIVER FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationBD8374EFJ-ME2
Current - Output / Channel500 mA
DimmingPWM
Frequency [Max]5 kHz
Frequency [Min]100 Hz
GradeAutomotive
Internal Switch(s)True
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Package / CaseExposed Pad, 8-SOIC
Package / Case [x]0.154 in
Package / Case [y]3.9 mm
QualificationAEC-Q100
Supplier Device Package8-HTSOP-J
TypeLinear
Voltage - Supply (Max) [Max]42 V
Voltage - Supply (Min) [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 4.03
10$ 2.65
25$ 2.30
100$ 1.89
250$ 1.70
500$ 1.58
1000$ 1.48
Digi-Reel® 1$ 4.03
10$ 2.65
25$ 2.30
100$ 1.89
250$ 1.70
500$ 1.58
1000$ 1.48
N/A 4816$ 2.70
Tape & Reel (TR) 2500$ 1.38
5000$ 1.33

Description

General part information

BD8374 Series

BD8374EFJ-M is a LED source driver with the capability of withstanding high input voltage (50V Max.). The fixed current output is possible by PWM brightness, and it is suitable for automotive LED drive. It is built into LED open/short protection and overheating protection at over voltage, and high reliability can be achieved. When driving two or more LED by using two or more LSI, it can be done to control LED all together turning off even if LED causes short/open in a certain row.

Documents

Technical documentation and resources

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

BD8374EFJ-M Data Sheet

Data Sheet

How to Use the Two-Resistor Model

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Five Steps for Successful Thermal Design of IC

White Paper

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Impact of PWM Dimming on the Conducted EMI

Technical Article

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

ROHM Automotive Lighting Solutions

White Paper

Judgment Criteria of Thermal Evaluation

Thermal Design

HTSOP-J8 Package Information

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

UL94 Flame Classifications of Mold Compound

Environmental Data

Thermal Resistance

Thermal Design

Factory Information

Manufacturing Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Anti-Whisker formation

Package Information

Compliance with the ELV directive

Environmental Data

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

AEC-Q101 Automotive Requirements

Related Document