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28-TSSOP
Integrated Circuits (ICs)

MSP430FR5732IPW

Active
Texas Instruments

24 MHZ MCU WITH 8KB FRAM, 1KB SRAM, COMPARATOR, UART/SPI/I2C, TIMER

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Search across all available documentation for this part.

DocumentsMSP430FR5732 Microcontroller Errata (Rev. AG)MSP430FR57xx Family User's Guide (Rev. D)+27
28-TSSOP
Integrated Circuits (ICs)

MSP430FR5732IPW

Active
Texas Instruments

24 MHZ MCU WITH 8KB FRAM, 1KB SRAM, COMPARATOR, UART/SPI/I2C, TIMER

Deep-Dive with AI

DocumentsMSP430FR5732 Microcontroller Errata (Rev. AG)MSP430FR57xx Family User's Guide (Rev. D)+27

Technical Specifications

Parameters and characteristics for this part

SpecificationMSP430FR5732IPW
ConnectivitySCI, I2C, LINbus, SPI, UART/USART, IrDA
Core ProcessorMSP430 CPUXV2
Core Size16-Bit
Mounting TypeSurface Mount
Number of I/O21 I/O
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Oscillator TypeInternal
Package / Case28-TSSOP
Package / Case0.173 in
Package / Case [y]4.4 mm
Program Memory TypeFRAM
RAM Size1 K
Speed24 MHz
Supplier Device Package28-TSSOP
Voltage - Supply (Vcc/Vdd) [Max]3.6 V
Voltage - Supply (Vcc/Vdd) [Min]2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 3.14
10$ 2.82
50$ 2.67
100$ 2.31
250$ 2.20
500$ 1.97
1000$ 1.66
2500$ 1.58
5000$ 1.52
Texas InstrumentsTUBE 1$ 2.16
100$ 1.76
250$ 1.39
1000$ 1.18

Description

General part information

MSP430FR5732 Series

The TI MSP430FR573x family of ultra-low-power microcontrollers consists of multiple devices that feature embedded FRAM nonvolatile memory, ultra-low-power 16-bit MSP430™ CPU, and different peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption. Peripherals include a 10-bit ADC, a 16-channel comparator with voltage reference generation and hysteresis capabilities, three enhanced serial channels capable of I2C, SPI, or UART protocols, an internal DMA, a hardware multiplier, an RTC, five 16-bit timers, and digital I/Os.

The TI MSP430FR573x family of ultra-low-power microcontrollers consists of multiple devices that feature embedded FRAM nonvolatile memory, ultra-low-power 16-bit MSP430™ CPU, and different peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption. Peripherals include a 10-bit ADC, a 16-channel comparator with voltage reference generation and hysteresis capabilities, three enhanced serial channels capable of I2C, SPI, or UART protocols, an internal DMA, a hardware multiplier, an RTC, five 16-bit timers, and digital I/Os.

Documents

Technical documentation and resources

MSP430FR5732 Microcontroller Errata (Rev. AG)

Errata

MSP430FR57xx Family User's Guide (Rev. D)

User guide

MSP Code Protection Features

Application note

MSP430 FRAM Technology – How To and Best Practices (Rev. B)

Application note

Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)

Application note

MSP430 System-Level ESD Considerations (Rev. B)

Application note

MSP430 FRAM Quality and Reliability (Rev. A)

Application note

Microcontrollers in Optical Networking

White paper

Low-Power FRAM Microcontrollers and Their Applications

White paper

MSP430 MCUs Development Guide Book (Rev. A)

User guide

MSP430 System ESD Troubleshooting Guide

Application note

Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)

Application note

FRAM FAQs

White paper

ESD Diode Current Specification (Rev. B)

Application note

RF430FRL152H Novel Ferroelectric RAM Memory NFC Embedded Tag Based Sensors

White paper

Benchmarking MCU power consumption for ultra-low-power applications

White paper

Industrial Communications Solutions Featuring MSP Microcontrollers

White paper

Migrating from the USCI Module to the eUSCI Module (Rev. A)

Application note

Safety Manual for MSP430G2xx, F5xx, and FR57xx in IEC 60730 Safety Applications (Rev. A)

Functional safety information

Design Considerations When Using the MSP430 Graphics Library

Application note

Crypto-Bootloader - Secure In-Field Firmware Updates for Ultra-Low Power MCUs

White paper

System advantages of mixed signal integration

White paper

Power Management Solutions for Ultra-Low-Power 16-Bit MSP430 MCUs (Rev. D)

White paper

Maximizing Write Speed on the MSP430™ FRAM (Rev. B)

Application note

Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B)

Application note

MSP430FR573x Mixed-Signal Microcontrollers datasheet (Rev. L)

Data sheet

Ultra-low power consumption MSP430FR57xx with FRAM memory

White paper

Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers

White paper

Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)

Application note