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UPD48288236AF1-E24-DW1-A
Integrated Circuits (ICs)

UPD48288236AF1-E24-DW1-A

Obsolete
Renesas Electronics Corporation

IC DRAM 288MBIT HSTL 144TFBGA

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Search across all available documentation for this part.

UPD48288236AF1-E24-DW1-A
Integrated Circuits (ICs)

UPD48288236AF1-E24-DW1-A

Obsolete
Renesas Electronics Corporation

IC DRAM 288MBIT HSTL 144TFBGA

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationUPD48288236AF1-E24-DW1-A
Access Time500 ps
Clock Frequency400 MHz
Memory FormatDRAM
Memory InterfaceHSTL
Memory Organization8 M
Memory Size288 Mbit
Memory TypeVolatile
Mounting TypeSurface Mount
Operating Temperature [Max]95 °C
Operating Temperature [Min]0 °C
Package / Case144-TBGA
Supplier Device Package144-TFBGA (11x18.5)
TechnologyLLDRAM
Voltage - Supply [Max]1.9 V
Voltage - Supply [Min]1.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1553$ 53.88

Description

General part information

UPD48288236AF1-E24-DW1-A Series

Low Latency DRAM is our newest large-density memory boasting high performance. Incorporating high-performance technology used in our synchronous SRAM and the pseudo-SRAM technology used in mobile-specified RAM, Low Latency DRAM is ideal for use in various networking applications. With a Fast random access time-and data latency lower than other DRAM products-Low Latency DRAM realizes extremely high performance compared to commodity DRAM. Those features, combined with large density and lower cost per bit compared to SRAM solutions make Low Latency DRAM an attractive choice for use in next-generation, high-performance networking products.

Documents

Technical documentation and resources