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ROHM RF4P060BGTCR
Discrete Semiconductor Products

RF4P060BGTCR

Active
Rohm Semiconductor

MOSFET, N-CH, 100V, 6A, DFN2020 ROHS COMPLIANT: YES

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ROHM RF4P060BGTCR
Discrete Semiconductor Products

RF4P060BGTCR

Active
Rohm Semiconductor

MOSFET, N-CH, 100V, 6A, DFN2020 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRF4P060BGTCR
Current - Continuous Drain (Id) @ 25°C6 A
Drain to Source Voltage (Vdss)100 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]6.7 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]305 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerUDFN
Power Dissipation (Max)2 W
Rds On (Max) @ Id, Vgs53 mOhm
Supplier Device PackageDFN2020-8S
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2223$ 1.10
NewarkEach (Supplied on Cut Tape) 1$ 1.43
10$ 0.99
25$ 0.90
50$ 0.80
100$ 0.71
250$ 0.65
500$ 0.59
1000$ 0.54

Description

General part information

RF4P060BG Series

RF4P060BG is a power MOSFET with low on-resistance and High power small mold package, suitable for switching.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

RF4P060BGTCR | Datasheet

Datasheet

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Package Dimensions

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Part Explanation

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Compliance of the RoHS directive

Environmental Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Explanation for Marking

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

RF4P060BG ESD Data

Characteristics Data

About Export Regulations

Export Information

How to Use LTspice® Models

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Types and Features of Transistors

Application Note

Anti-Whisker formation - Transistors

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

What Is Thermal Design

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Flammability of Materials

Environmental Data

List of Transistor Package Thermal Resistance

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Taping Information

Package Information