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Discrete Semiconductor Products

RSJ400N10TL

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Rohm Semiconductor

MOSFET, N-CH, 100V, 40A, TO-263

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Search across all available documentation for this part.

Product dimension image
Discrete Semiconductor Products

RSJ400N10TL

Active
Rohm Semiconductor

MOSFET, N-CH, 100V, 40A, TO-263

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRSJ400N10TL
Drain to Source Voltage (Vdss)100 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs90 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]3600 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseD2PAK (2 Leads + Tab), TO-263-3, TO-263AB
Power Dissipation (Max)50 W
Power Dissipation (Max)1.35 W
Rds On (Max) @ Id, Vgs27 mOhm
Supplier Device PackageLPTS
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 4.78
NewarkEach (Supplied on Cut Tape) 1$ 4.64
10$ 3.03
25$ 2.70
50$ 2.54
100$ 2.36
300$ 2.30
500$ 1.96
1000$ 1.79

Description

General part information

RSJ400N10 Series

MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobile equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.

Documents

Technical documentation and resources

Taping Information

Package Information

Explanation for Marking

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Reliability Test Result

Manufacturing Data

How to Use LTspice® Models

Schematic Design & Verification

Inner Structure

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

RSJ400N10 Data Sheet

Data Sheet

Moisture Sensitivity Level - Transistors

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Report of SVHC under REACH Regulation

Environmental Data

RSJ400N10 ESD Data

Characteristics Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Part Explanation

Application Note

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Package Dimensions

Package Information

About Flammability of Materials

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Export Regulations

Export Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Create Symbols for PSpice Models

Models

List of Transistor Package Thermal Resistance

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Types and Features of Transistors

Application Note

Condition of Soldering / Land Pattern Reference

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance of the RoHS directive

Environmental Data

Technical Data Sheet EN

Datasheet