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ROHM BAT54AHYT116
Discrete Semiconductor Products

BAT54AHYT116

Active
Rohm Semiconductor

SMALL SIGNAL SCHOTTKY DIODE, DUAL COMMON ANODE, 30 V, 200 MA, 800 MV, 600 MA, 150 °C

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ROHM BAT54AHYT116
Discrete Semiconductor Products

BAT54AHYT116

Active
Rohm Semiconductor

SMALL SIGNAL SCHOTTKY DIODE, DUAL COMMON ANODE, 30 V, 200 MA, 800 MV, 600 MA, 150 °C

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationBAT54AHYT116
Current - Average Rectified (Io) (per Diode)200 mA
Current - Reverse Leakage @ Vr2 çA
Diode Configuration1 Pair Common Anode
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseSOT-23-3, TO-236-3, SC-59
Reverse Recovery Time (trr)50 ns
Speed200 mA
SpeedAny Speed
Supplier Device PackageSOT-23
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]30 V
Voltage - Forward (Vf) (Max) @ If800 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1106$ 0.42

Description

General part information

BAT54AHY Series

BAT54AHY is low VFand high reliability Schottky Barrier Diode, suitable for small current rectification.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

What Is Thermal Design

Thermal Design

About Flammability of Materials

Environmental Data

Package Dimensions

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Compliance of the RoHS directive

Environmental Data

List of Diode Package Thermal Resistance

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

About Export Regulations

Export Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Explanation for Marking

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Part Explanation

Application Note

How to Select Rectifier Diodes

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

BAT54AHY Data Sheet

Data Sheet

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information

Diode Types and Applications

Technical Article

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Anti-Whisker formation - Diodes

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Taping Information

Package Information