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HP8MC5TB1
Discrete Semiconductor Products

HP8MC5TB1

Active
Rohm Semiconductor

MOSFET, N/P-CH, 60 V, 12A, 20W, HSOP ROHS COMPLIANT: YES

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HP8MC5TB1
Discrete Semiconductor Products

HP8MC5TB1

Active
Rohm Semiconductor

MOSFET, N/P-CH, 60 V, 12A, 20W, HSOP ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationHP8MC5TB1
ConfigurationN and P-Channel
Current - Continuous Drain (Id) @ 25°C12 A, 5 A, 4.5 A
Drain to Source Voltage (Vdss)60 V
Gate Charge (Qg) (Max) @ Vgs17.3 nC, 3.1 nC
Input Capacitance (Ciss) (Max) @ Vds135 pF, 850 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power - Max20 W, 3 W
Rds On (Max) @ Id, Vgs96 mOhm, 90 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2345$ 1.98
NewarkEach (Supplied on Cut Tape) 1$ 1.78
10$ 1.26
25$ 1.13
50$ 1.01
100$ 0.89
250$ 0.78
500$ 0.70
1000$ 0.63

Description

General part information

HP8MC5 Series

HP8MC5 is a low on-resistance MOSFET ideal for switching applications.

Documents

Technical documentation and resources

Moisture Sensitivity Level - Transistors

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Export Regulations

Export Information

Taping Information

Package Information

Anti-Whisker formation - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Types and Features of Transistors

Application Note

Report of SVHC under REACH Regulation

Environmental Data

Compliance of the RoHS directive

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Explanation for Marking

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Package Dimensions

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

HP8MC5 ESD Data

Characteristics Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Part Explanation

Application Note

HSOP8(Symmetry Dual) Condition of Soldering / Land Pattern Reference

Package Information

What Is Thermal Design

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

About Flammability of Materials

Environmental Data

HP8MC5 Data Sheet

Data Sheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

P-channel Power MOSFETs selection guide

Technical Article