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RB451FT106
Discrete Semiconductor Products

UMZ16NT106

Active
Rohm Semiconductor

ZENER ARRAYS FOR TERMINAL PROTECTION DEVICES

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RB451FT106
Discrete Semiconductor Products

UMZ16NT106

Active
Rohm Semiconductor

ZENER ARRAYS FOR TERMINAL PROTECTION DEVICES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationUMZ16NT106
Configuration1 Pair Common Anode
Current - Reverse Leakage @ Vr100 nA
Impedance (Max) (Zzt) [Max]50 Ohms
Mounting TypeSurface Mount
Package / CaseSOT-323, SC-70
Power - Max [Max]200 mW
Supplier Device PackageUMD3
Voltage - Zener (Nom) (Vz)16 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 3000$ 0.18
NewarkEach (Supplied on Cut Tape) 1$ 0.79
10$ 0.55
25$ 0.51
50$ 0.48
100$ 0.40
250$ 0.34
500$ 0.28
1000$ 0.24

Description

General part information

UMZ16 Series

UMZ16NUM is a Transient Voltage Suppressor with small mold package, suitable for Surge Protection.

Documents

Technical documentation and resources

UMD3 T106 Taping Spec

Datasheet

UMD3 Part Marking

Related Document

Diode Flammability

Related Document

Technical Data Sheet EN

Datasheet

Inner Structure

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

ESD Data

Characteristics Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Moisture Sensitivity Level - Diodes

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

How to Create Symbols for PSpice Models

Models

Anti-Whisker formation - Diodes

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice&reg; Models

Schematic Design & Verification

PCB Layout for TVS Diodes

Schematic Design & Verification

What Are TVS Diodes?

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Low-Side Current Sensing Circuit Design

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

What Is Thermal Design

Thermal Design

Differences between TVS and Zener Diodes

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Export Regulations

Export Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Package Dimensions

Package Information

Selection Method and Usage of TVS Diodes

Technical Article

Compliance of the RoHS directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Part Explanation

Application Note

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Reliability Test Result

Manufacturing Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Diode Types and Applications

Technical Article

Constitution Materials List

Environmental Data