Deep-Dive with AI
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Deep-Dive with AI
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Technical Specifications
Parameters and characteristics for this part
| Specification | 8300SB1-LF |
|---|---|
| Board Thickness | 0.79 mm |
| Board Thickness | 0.031 in |
| Board Thickness | 0.03125 in |
| Circuit Pattern | 5 Hole Pad (Both Sides) |
| Pitch | 0.1 " |
| Pitch | 2.54 mm |
| Plating | Non-Plated Through Hole (NPTH) |
| Proto Board Type | Breadboard, General Purpose |
| Size / Dimension [x] | 167.6 mm |
| Size / Dimension [x] | 6.6 " |
| Size / Dimension [y] | 69.9 mm |
| Size / Dimension [y] | 2.75 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | N/A | 0 | $ 9.80 | |
Description
General part information
8300SB1 Series
Breadboard, General Purpose Non-Plated Through Hole (NPTH) 5 Hole Pad (Both Sides) 0.100" (2.54mm)
Documents
Technical documentation and resources