Connectors, Interconnects

100-022-000

Obsolete

CONN IC DIP SOCKET 22POS GOLD

Search across all available documentation for this part.

Connectors, Interconnects

Obsolete

CONN IC DIP SOCKET 22POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	100-022-000

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	8 µin
Contact Finish Thickness - Mating	0.203 µm
Contact Finish Thickness - Post	Flash
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	1 A
Features	Open Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	22
Number of Positions or Pins (Grid) [x]	2
Number of Positions or Pins (Grid) [y]	11
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-65 ░C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length [x]	3.2 mm
Termination Post Length [x]	0.126 in
Type	0.4 in
Type	DIP

Part	Material Flammability Rating	Termination Post Length [x]	Termination Post Length [x]	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Housing Material	Contact Material - Post [custom]	Contact Finish - Post	Contact Finish - Mating	Features	Pitch - Mating	Pitch - Mating	Type	Type	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Termination	Contact Material - Mating	Mounting Type
3M Electronic Specialty 100-022-000	UL94 V-0	3.2 mm	0.126 in	1 A	Flash	8 µin	0.203 µm	-65 ░C	125 °C	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Brass	Gold	Gold	Open Frame	0.1 "	2.54 mm	0.4 in	DIP	11	22	2	Solder	Beryllium Copper	Through Hole
3M Electronic Specialty 100-022-050	UL94 V-0	3.2 mm	0.126 in	1 A	Flash	8 µin	0.203 µm	-65 ░C	125 °C	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Brass	Gold	Gold	Open Frame	0.1 "	2.54 mm	0.4 in	DIP	11	22	2	Solder	Beryllium Copper	Through Hole

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.00

General part information

22 (2 x 11) Pos DIP, 0.4" (10.16mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources

No documents available