The HMC560 devices are passive, double-balanced MMIC mixers available in a chip (HMC560) an SMT leadless chip carrier package (HMC560LM3). The mixers are fabricated in a GaAs metal semiconductor field effect transistor (MESFET) process and can be used as upconverters or downconverters from 24 GHz to 40 GHz. The wide bandwidth allows this device to be used across multiple radio bands with a common platform. Excellent isolations are provided by on-chip baluns, and the chip (HMC560) requires no external components and no dc bias. Measurements were made with the chip (HMC560) mounted and ribbon bonded into in a 50 Ω microstrip test fixture. Measured data includes the parasitic effects of the assembly. RF connections to the chip (HMC560) were made with 0.076 mm (3-mil) ribbon bond with minimal length less than 0.31 mm (<12 mil). The HMC560LM3 requires no external components and no dc bias. All data is with the nonhermetic, epoxy sealed LM3 package mounted in a 50 Ω test fixture. Utilizing the HMC560LM3 eliminates the need for wire bonding, thereby providing a consistent connection interface for the customer, and allowing the use of surface mount manufacturing techniques.ApplicationsTest equipment and sensorsMicrowave point-to-point radiosPoint-to-multipoint radiosMilitarySpace