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RB048RSM20STFTL1
Discrete Semiconductor Products

RB048RSM20STFTL1

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Rohm Semiconductor

200V 8A, TO-277A, ULTRA LOW IRSBD FOR AUTOMOTIVE

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RB048RSM20STFTL1
Discrete Semiconductor Products

RB048RSM20STFTL1

Active
Rohm Semiconductor

200V 8A, TO-277A, ULTRA LOW IRSBD FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRB048RSM20STFTL1
Current - Average Rectified (Io)8 A
Current - Reverse Leakage @ Vr4.3 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction175 °C
Package / CaseTO-277, 3-PowerDFN
QualificationAEC-Q101
Speed500 ns, 200 mA
Supplier Device PackageTO-277A
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If [Max]900 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3820$ 2.20

Description

General part information

RB048RSM20STF Series

RB048RSM20STF is a ultra low IRschottky barrier diode, suitable for Switching power supply, Freewheel diode, Reverse polarity protection. It is a highly reliable product for automotive.

Documents

Technical documentation and resources

RB048RSM20STFTL1 | Datasheet

Datasheet

Judgment Criteria of Thermal Evaluation

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Part Explanation

Application Note

Method for Monitoring Switching Waveform

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

About Export Regulations

Export Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Anti-Whisker formation - Diodes

Package Information

How to Use LTspice&reg; Models

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

List of Diode Package Thermal Resistance

Thermal Design

How to Select Rectifier Diodes

Technical Article

What Is Thermal Design

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Compliance of the RoHS directive

Environmental Data

TO-277GE Dimensions

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Diode Types and Applications

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

Power Loss and Thermal Design of Diodes

Thermal Design