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8-HSMT
Discrete Semiconductor Products

RQ3C150BCTB

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Rohm Semiconductor

MOSFET P-CHANNEL 20V 30A 8HSMT

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8-HSMT
Discrete Semiconductor Products

RQ3C150BCTB

Active
Rohm Semiconductor

MOSFET P-CHANNEL 20V 30A 8HSMT

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ3C150BCTB
Current - Continuous Drain (Id) @ 25°C30 A
Drain to Source Voltage (Vdss)20 V
Drive Voltage (Max Rds On, Min Rds On)4.5 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs60 nC
Input Capacitance (Ciss) (Max) @ Vds4800 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerVDFN
Power Dissipation (Max)20 W
Rds On (Max) @ Id, Vgs6.7 mOhm
Supplier Device Package [custom]8-HSMT
Supplier Device Package [x]3.2
Supplier Device Package [y]3
TechnologyMOSFET (Metal Oxide)
Vgs (Max) [Max]8 V
Vgs(th) (Max) @ Id1.2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.15
10$ 0.94
100$ 0.73
500$ 0.62
1000$ 0.50
Digi-Reel® 1$ 1.15
10$ 0.94
100$ 0.73
500$ 0.62
1000$ 0.50
N/A 7776$ 1.20
Tape & Reel (TR) 3000$ 0.47
6000$ 0.45
9000$ 0.43

Description

General part information

RQ3C150 Series

The Middle Power MOSFET RQ3C150BC is suitable for switching and load switch.

Documents

Technical documentation and resources

HSMT8 TB Taping Spec

Datasheet

HSMT8 Part Marking

Related Document

Transistor, MOSFET Flammability

Related Document

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

HSMT8 Single Cu Inner Structure

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

Package Dimensions

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Compliance of the RoHS directive

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Part Explanation

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Export Regulations

Export Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Create Symbols for PSpice Models

Models

Method for Monitoring Switching Waveform

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

ESD Data

Characteristics Data

How to Use LTspice® Models

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

What Is Thermal Design

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Types and Features of Transistors

Application Note

Condition of Soldering / Land Pattern Reference

Package Information

RQ3C150BC Data Sheet

Data Sheet

Moisture Sensitivity Level - Transistors

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design