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Discrete Semiconductor Products

RB068LAM100TFTR

Active
Rohm Semiconductor

SUPER LOW IR, 100V, 2A, SOD-128, SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsBasics of Thermal Resistance and Heat DissipationMeasurement Method and Usage of Thermal Resistance RthJC+45
Product thumbnail image
Discrete Semiconductor Products

RB068LAM100TFTR

Active
Rohm Semiconductor

SUPER LOW IR, 100V, 2A, SOD-128, SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE

Deep-Dive with AI

DocumentsBasics of Thermal Resistance and Heat DissipationMeasurement Method and Usage of Thermal Resistance RthJC+45

Technical Specifications

Parameters and characteristics for this part

SpecificationRB068LAM100TFTR
Current - Average Rectified (Io)2 A
Current - Reverse Leakage @ Vr1.5 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseSOD-128
QualificationAEC-Q101
Speed500 ns, 200 mA
Supplier Device PackagePMDTM
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]100 V
Voltage - Forward (Vf) (Max) @ If [Max]810 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 29$ 0.69
NewarkEach (Supplied on Cut Tape) 1$ 0.81
1$ 0.81
10$ 0.54
10$ 0.54
25$ 0.49
25$ 0.49
50$ 0.43
50$ 0.43
100$ 0.37
100$ 0.37
250$ 0.35
250$ 0.35
500$ 0.33
500$ 0.33
1000$ 0.28
1000$ 0.28

Description

General part information

RB068LAM100TF Series

RB068LAM100TF is the high reliability Automotive Schottky Barrier Diode, suitable for general rectification.

Documents

Technical documentation and resources

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Inner Structure

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

RB068LAM100TF Data Sheet

Data Sheet

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Anti-Whisker formation - Diodes

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Compliance of the RoHS directive

Environmental Data

Reliability Test Result

Manufacturing Data

Taping Information

Package Information

List of Diode Package Thermal Resistance

Thermal Design

About Export Regulations

Export Information

What is a Thermal Model? (Diode)

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

How to Use LTspice&reg; Models

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

ESD Data

Characteristics Data

Explanation for Marking

Package Information

Part Explanation

Application Note

What Is Thermal Design

Thermal Design

How to Select Rectifier Diodes

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

Report of SVHC under REACH Regulation

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Diode Types and Applications

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Package Dimensions

Package Information

Moisture Sensitivity Level - Diodes

Package Information

Power Loss and Thermal Design of Diodes

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Product Change Notice EN

Datasheet

Technical Data Sheet EN

Datasheet