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ROHM DTC023YUBTL
Discrete Semiconductor Products

DTC015EUBTL

Active
Rohm Semiconductor

NPN, SOT-323FL, R1=R2 POTENTIAL DIVIDER TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

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ROHM DTC023YUBTL
Discrete Semiconductor Products

DTC015EUBTL

Active
Rohm Semiconductor

NPN, SOT-323FL, R1=R2 POTENTIAL DIVIDER TYPE DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Technical Specifications

Parameters and characteristics for this part

SpecificationDTC015EUBTL
Current - Collector (Ic) (Max) [Max]100 mA
Current - Collector Cutoff (Max) [Max]500 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]80
Frequency - Transition250 MHz
Mounting TypeSurface Mount
Package / CaseSC-85
Power - Max [Max]200 mW
Resistor - Base (R1)100 kOhms
Resistor - Emitter Base (R2)100 kOhms
Resistors IncludedR1, R2
Supplier Device PackageUMT3F
Transistor TypeNPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic100 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.24
10$ 0.15
100$ 0.09
500$ 0.07
1000$ 0.06
Digi-Reel® 1$ 0.24
10$ 0.15
100$ 0.09
500$ 0.07
1000$ 0.06
Tape & Reel (TR) 3000$ 0.04
6000$ 0.04
9000$ 0.03
15000$ 0.03
21000$ 0.03
30000$ 0.03
75000$ 0.03
NewarkEach (Supplied on Cut Tape) 1$ 0.26
10$ 0.21

Description

General part information

DTC015 Series

These are the standard products of "digital transistors" which ROHM invented and marketed first in the world.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Transistor, MOSFET Flammability

Related Document

UMT3 Part Marking

Related Document

UMT3 T106 Taping Spec

Datasheet

UMT3F Inner Structure

Related Document

Package Dimensions

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Taping Information

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

What Is Thermal Design

Thermal Design

Reliability Test Result

Manufacturing Data

How to Use LTspice® Models

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

About Export Regulations

Export Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Explanation for Marking

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Part Explanation

Application Note

Compliance of the RoHS directive

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

ESD Data

Characteristics Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Types and Features of Transistors

Application Note

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification