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Discrete Semiconductor Products

RGTH80TS65GC13

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Rohm Semiconductor

HIGH-SPEED SWITCHING TYPE, 650V 40A, TO-247N, FIELD STOP TRENCH IGBT

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Product dimension image
Discrete Semiconductor Products

RGTH80TS65GC13

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING TYPE, 650V 40A, TO-247N, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGTH80TS65GC13
Current - Collector (Ic) (Max) [Max]70 A
Gate Charge79 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-247-3
Power - Max [Max]234 W
Supplier Device PackageTO-247G
Td (on/off) @ 25°C120 ns
Td (on/off) @ 25°C34 ns
Test Condition10 Ohm, 40 A, 400 V, 15 V
Vce(on) (Max) @ Vge, Ic2.1 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 4.54
10$ 3.05
100$ 2.56
600$ 2.57
1200$ 2.56
NewarkEach 1$ 6.35
10$ 4.27
25$ 4.26
50$ 3.73
100$ 3.20
250$ 3.19

Description

General part information

RGTH80TS65 Series

ROHM's IGBT products will contribute to energy saving high efficiency and a wide range of high voltage and high-current applications.

Documents

Technical documentation and resources

What Is Thermal Design

Thermal Design

How to Create Symbols for PSpice Models

Models

Compliance of the ELV directive

Environmental Data

RGTH80TS65 Data Sheet

Data Sheet

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Types and Features of Transistors

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

Moisture Sensitivity Level

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Reliability Test Result

Manufacturing Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Export Administration Regulations (EAR)

Export Information

Anti-Whisker formation

Package Information

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

About Flammability of Materials

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Technical Data Sheet EN

Datasheet