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Discrete Semiconductor Products

RQ6A045ZPTR

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Rohm Semiconductor

PCH -12V -4.5A SMALL SIGNAL MOSFET

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Product dimension image
Discrete Semiconductor Products

RQ6A045ZPTR

Active
Rohm Semiconductor

PCH -12V -4.5A SMALL SIGNAL MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ6A045ZPTR
Current - Continuous Drain (Id) @ 25°C4.5 A
Drain to Source Voltage (Vdss)12 V
Drive Voltage (Max Rds On, Min Rds On)1.5 V, 4.5 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs31 nC
Input Capacitance (Ciss) (Max) @ Vds2450 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-6 Thin, TSOT-23-6
Power Dissipation (Max)950 mW
Rds On (Max) @ Id, Vgs35 mOhm
Supplier Device PackageTSMT6 (SC-95)
TechnologyMOSFET (Metal Oxide)
Vgs (Max)10 V
Vgs(th) (Max) @ Id1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.78
Digi-Reel® 1$ 0.78
N/A 0$ 1.20
Tape & Reel (TR) 3000$ 0.30
6000$ 0.28
9000$ 0.26
30000$ 0.26

Description

General part information

RQ6A045 Series

RQ6A045ZP is the low on - resistance MOSFET, built-in G-S protection diode for switching application.

Documents

Technical documentation and resources

TSMT6_TR Taping Information

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

RQ6A045ZP ESD Data

Characteristics Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

P-channel Power MOSFETs selection guide

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Explanation for Marking

Package Information

What Is Thermal Design

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Compliance of the RoHS directive

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Create Symbols for PSpice Models

Models

About Export Regulations

Export Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

About Flammability of Materials

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Types and Features of Transistors

Application Note

How to Use LTspice® Models

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Package Dimensions

Package Information

Reliability Test Result

Manufacturing Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Part Explanation

Application Note

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

RQ6A045ZP Data Sheet

Data Sheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design