
Deep-Dive with AI
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Deep-Dive with AI
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Technical Specifications
Parameters and characteristics for this part
| Specification | SP33R6-04UTG |
|---|---|
| Applications | USB |
| Bidirectional Channels | 4 |
| Capacitance @ Frequency | 0.2 pF |
| Current - Peak Pulse (10/1000µs) | 3 A |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 10-UFDFN |
| Power Line Protection | False |
| Supplier Device Package | 10-µDFN |
| Supplier Device Package [x] | 2.5 |
| Supplier Device Package [y] | 1 |
| Type | Zener |
| Voltage - Breakdown (Min) [Min] | 600 mV |
| Voltage - Clamping (Max) @ Ipp | 3.3 V |
| Voltage - Reverse Standoff (Typ) [Max] | 300 mV |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
SP33R6-04UTG Series
Benchmark setting breakdown voltage performance, protectingsub 20 nm I/O’s. Finer geometry chip designs run the risk ofdamage at voltage levels higher than 3.3V. The SP33R6-04UTG providesheadroom to support all of the low voltage differential signaling(0.3V) while protecting the data lines from damaging over voltage,starting at 0.6V.
Documents
Technical documentation and resources