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Technical Specifications

Parameters and characteristics for this part

SpecificationADPA7009-2ACEZ-R7
Current - Supply850 mA
Frequency (Max)54 GHz
Frequency (Min)20 GHz
Gain16.5 dB
Mounting TypeSurface Mount
Noise Figure7.5 dB
P1dB28 dB
Package / Case24-LFLGA Exposed Pad
Package Length5 mm
Package Name24-LGA-CAV
Package Width5 mm
Test Frequency (Maximum)35 GHz
Test Frequency (Minimum)20 GHz
Voltage - Supply (Maximum)5 V
Voltage - Supply (Minimum)3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$Updated
DigikeyTape & Reel (TR) 1000$ 296.51<1d

CAD

3D models and CAD resources for this part

Description

General part information

ADPA7009-2 Series

The ADPA7009-2 is a gallium arsenide (GaAs), pseudomorphic high-electron-mobility transistor (pHEMT), monolithic microwave integrated circuit (MMIC), 0.5 W power amplifier with an integrated temperature-compensated, on-chip power detector that operates between 20 GHz and 54 GHz. The amplifier provides a gain of 17.5 dB, an output power for 1 dB compression (OP1dB) of 28 dBm, and a typical output third-order intercept (OIP3) of 34.5 dBm at 20 GHz to 35 GHz. The ADPA7009-2 requires 850 mA from a 5 V supply voltage (VDDx). The RF input and outputs are internally matched and DC-blocked for ease of integration into higher level assemblies. Most of the typically required external passive components for operation (AC coupling capacitors and power supply decoupling capacitors) are integrated, which facilitates a small, compact printed circuit board (PCB) footprint. The ADPA7009-2 is available in a 5.00 mm × 5.00 mm, 24-terminal chip array, small outline, no lead cavity [LGA_CAV] package.APPLICATIONSMilitary and spaceTest instrumentation