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MT44K32M36RB-107E:A
Integrated Circuits (ICs)

MT44K32M36RB-107E:A

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Micron Technology Inc.

DRAM, DDR, 1.125 GBIT, 32M X 36BIT, 1.2 GHZ, BGA, 168 PINS

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MT44K32M36RB-107E:A
Integrated Circuits (ICs)

MT44K32M36RB-107E:A

Active
Micron Technology Inc.

DRAM, DDR, 1.125 GBIT, 32M X 36BIT, 1.2 GHZ, BGA, 168 PINS

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationMT44K32M36RB-107E:A
Access Time8 ns
Clock Frequency933 MHz
Memory FormatDRAM
Memory InterfaceParallel
Memory Organization32M x 36
Memory Size1.125 Gbit
Memory TypeVolatile
Mounting TypeSurface Mount
Operating Temperature [Max]95 °C
Operating Temperature [Min]0 °C
Package / Case168-TBGA
Supplier Device Package168-BGA (13.5x13.5)
TechnologyRLDRAM 3
Voltage - Supply [Max]1.42 V
Voltage - Supply [Min]1.28 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 55.66
Tray 1190$ 55.32
NewarkEach 100$ 48.96

Description

General part information

MT44K32M36 Series

MT44K32M36RB-107E:A is a RLDRAM®3 high-speed memory device designed for high-bandwidth data storage-telecommunications, networking, cache applications, and so forth. The chip’s 16-bank architecture is optimized for sustainable high-speed operation. The DDR I/O interface transfers two data bits per clock cycle at the I/O balls. Output data is referenced to the READ strobes. Commands, addresses, and control signals are also registered at every positive edge of the differential input clock, while input data is registered at both positive and negative edges of the input data strobes. The device is supplied with 1.35V for the core and 1.2V for the output drivers. The 2.5V supply is used for an internal supply. Bank-scheduled refresh is supported with the row address generated internally.

Documents

Technical documentation and resources