Specification	BC56PAS-QX

Current - Collector (Ic) (Max) [Max]	1 A
Current - Collector Cutoff (Max) [Max]	100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	40
Frequency - Transition	180 MHz
Grade	Automotive
Mounting Type	Surface Mount
Operating Temperature	150 °C
Package / Case	3-UDFN Exposed Pad
Power - Max [Max]	420 mW
Qualification	AEC-Q101
Supplier Device Package	DFN2020D-3
Transistor Type	NPN
Vce Saturation (Max) @ Ib, Ic	500 mV
Voltage - Collector Emitter Breakdown (Max) [Max]	80 V

BC56PAS-Q Series

80 V, 1 A NPN medium power transistors

Part	Qualification	Frequency - Transition	Power - Max [Max]	Grade	Supplier Device Package	Operating Temperature	DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	Current - Collector Cutoff (Max) [Max]	Voltage - Collector Emitter Breakdown (Max) [Max]	Current - Collector (Ic) (Max) [Max]	Vce Saturation (Max) @ Ib, Ic	Package / Case	Transistor Type	Mounting Type
Nexperia USA Inc. BC56PAS-QX	AEC-Q101	180 MHz	420 mW	Automotive	DFN2020D-3	150 °C	40	100 nA	80 V	1 A	500 mV	3-UDFN Exposed Pad	NPN	Surface Mount

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.09

Description

General part information

BC56PAS-Q Series

NPN medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

Documents

Technical documentation and resources

Thermal performance of DFN packages

Application note

80 V, 1 A NPN medium power transistors

Data sheet

plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body

Package information

plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body

Marcom graphics

BC56PAS-QX

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Technical Specifications

BC56PAS-Q Series

Pricing

Description

BC56PAS-Q Series

Documents

Thermal performance of DFN packages

80 V, 1 A NPN medium power transistors

plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body

plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body

DFN2020D-3; Reel pack for SMD, 7"; Q2/T3 product orientation

Thermal performance of DFN packages

Reflow soldering profile

BC56PAS-Q Nexperia Product Reliability

小巧轻便的汽车 二极管和晶体管

Nexperia package poster

Small & light automotive diodes and transistors

BC56PAS-Q Series

小巧轻便的汽车二极管和晶体管