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AG091FLD3HRBTL
Discrete Semiconductor Products

AG091FLD3HRBTL

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Rohm Semiconductor

NCH 60V 80A, TO-252 (DPAK), POWER MOSFET FOR AUTOMOTIVE

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AG091FLD3HRBTL
Discrete Semiconductor Products

AG091FLD3HRBTL

Active
Rohm Semiconductor

NCH 60V 80A, TO-252 (DPAK), POWER MOSFET FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationAG091FLD3HRBTL
Drain to Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]22 nC
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds [Max]1480 pF
Mounting TypeSurface Mount
Operating Temperature175 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max) [Max]76 W
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs7.5 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1890$ 2.34

Description

General part information

AG091FLD3HRB Series

AG091FLD3HRB is an automotive grade MOSFET that is AEC-Q101 qualified. Ideal for Automotive Systems.

Documents

Technical documentation and resources

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Compliance of the RoHS directive

Environmental Data

Anti-Whisker formation - Transistors

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

AG091FLD3HRB ESD Data

Characteristics Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Explanation for Marking

Package Information

Types and Features of Transistors

Application Note

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Part Explanation

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

What Is Thermal Design

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Package Dimensions

Package Information

Moisture Sensitivity Level - Transistors

Package Information

How to Use LTspice&reg; Models

Schematic Design & Verification

AG091FLD3HRB Data Sheet

Data Sheet

PCB Layout Thermal Design Guide

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Flammability of Materials

Environmental Data

List of Transistor Package Thermal Resistance

Thermal Design

TO-252_TL Taping Information

Package Information

About Export Regulations

Export Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design