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ROHM 2SD2703TL
Discrete Semiconductor Products

RAF040P01TCL

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Rohm Semiconductor

TRANSISTOR MOSFET P-CH 12V 4A 3-PIN TUMT EMBOSS T/R

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ROHM 2SD2703TL
Discrete Semiconductor Products

RAF040P01TCL

Active
Rohm Semiconductor

TRANSISTOR MOSFET P-CH 12V 4A 3-PIN TUMT EMBOSS T/R

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRAF040P01TCL
Current - Continuous Drain (Id) @ 25°C4 A
Drain to Source Voltage (Vdss)12 V
Drive Voltage (Max Rds On, Min Rds On)1.5 V, 4.5 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs37 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]4000 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Rds On (Max) @ Id, Vgs30 mOhm
Supplier Device PackageTUMT3
TechnologyMOSFET (Metal Oxide)
Vgs (Max) [Max]-8 V
Vgs(th) (Max) @ Id1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.54
10$ 0.46
100$ 0.32
500$ 0.25
1000$ 0.20
Digi-Reel® 1$ 0.54
10$ 0.46
100$ 0.32
500$ 0.25
1000$ 0.20
N/A 11622$ 0.82
Tape & Reel (TR) 3000$ 0.18
6000$ 0.17
9000$ 0.16
30000$ 0.16
MouserN/A 1$ 0.71
10$ 0.48
100$ 0.33
500$ 0.25
1000$ 0.22
3000$ 0.19
6000$ 0.18
9000$ 0.17
NewarkEach (Supplied on Cut Tape) 1$ 0.84
10$ 0.52
25$ 0.46
50$ 0.40
100$ 0.34
300$ 0.30
500$ 0.26
1000$ 0.23

Description

General part information

RAF040 Series

MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobile equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Application Note (PDF)

Application Notes

Packaging Info for Transistors

Datasheet

TUMT3 Part Marking

Related Document

Transistor, MOSFET Flammability

Related Document

ESD Data

Characteristics Data

Inner Structure

Package Information

Part Explanation

Application Note

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Compliance of the RoHS directive

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Taping Information

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Export Regulations

Export Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Types and Features of Transistors

Application Note

Reliability Test Result

Manufacturing Data

Anti-Whisker formation - Transistors

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Create Symbols for PSpice Models

Models

Moisture Sensitivity Level - Transistors

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

What Is Thermal Design

Thermal Design

Package Dimensions

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification