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ROHM RGTH40TK65GC11
Discrete Semiconductor Products

RGW60TK65DGVC11

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 30A, FRD BUILT-IN, TO-3PFM, FIELD STOP TRENCH IGBT

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ROHM RGTH40TK65GC11
Discrete Semiconductor Products

RGW60TK65DGVC11

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 30A, FRD BUILT-IN, TO-3PFM, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGW60TK65DGVC11
Current - Collector (Ic) (Max) [Max]33 A
Current - Collector Pulsed (Icm)120 A
Gate Charge84 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseTO-3PFM, SC-93-3
Power - Max [Max]72 W
Reverse Recovery Time (trr)92 ns
Supplier Device PackageTO-3PFM
Switching Energy490 µJ, 480 µJ
Td (on/off) @ 25°C37 ns, 114 ns
Test Condition30 A, 10 Ohm, 15 V, 400 V
Vce(on) (Max) @ Vge, Ic1.9 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 410$ 7.19
NewarkEach 1$ 4.47
10$ 3.27
25$ 3.16
50$ 3.15
100$ 3.15
250$ 3.13
900$ 3.10

Description

General part information

RGW60TK65D Series

RGW60TK65D is a high speed switching IGBT, suitable for PFC, Solar Inverter, UPS, Welding, IH applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

What is a Thermal Model? (IGBT)

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Compliance of the ELV directive

Environmental Data

What Is Thermal Design

Thermal Design

New Gen 3 650V IGBT - A Soft And Efficient Switch For Industrial Applications

Application Note

Package Dimensions

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Judgment Criteria of Thermal Evaluation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

About Flammability of Materials

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Part Explanation

Application Note

Moisture Sensitivity Level

Package Information

Types and Features of Transistors

Application Note

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Export Administration Regulations (EAR)

Export Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Anti-Whisker formation

Package Information

How to Create Symbols for PSpice Models

Models

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice&reg; Models

Schematic Design & Verification

4 Steps for Successful Thermal Designing of Power Devices

White Paper

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification