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SH8J31GZETB
Discrete Semiconductor Products

SH8J31GZETB

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Rohm Semiconductor

-60V PCH+PCH MIDDLE POWER MOSFET

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SH8J31GZETB
Discrete Semiconductor Products

SH8J31GZETB

Active
Rohm Semiconductor

-60V PCH+PCH MIDDLE POWER MOSFET

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationSH8J31GZETB
Configuration2 P-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C4.5 A
Drain to Source Voltage (Vdss)60 V
Gate Charge (Qg) (Max) @ Vgs40 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]2500 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Power - Max [Max]2 W
Rds On (Max) @ Id, Vgs70 mOhm
Supplier Device Package8-SOP
Vgs(th) (Max) @ Id3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 25895$ 1.65

Description

General part information

SH8J31 Series

SH8J31 is complex type (Pch+Pch) middle power MOSFET for Motor Drive application.

Documents

Technical documentation and resources

SH8J31GZETB | Datasheet

Datasheet

Part Explanation

Application Note

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Explanation for Marking

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Certificate of not containing SVHC under REACH Regulation

Environmental Data

List of Transistor Package Thermal Resistance

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

About Flammability of Materials

Environmental Data

ESD Data

Characteristics Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Types and Features of Transistors

Application Note

What is a Thermal Model? (Transistor)

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

How to Create Symbols for PSpice Models

Models

Compliance of the RoHS directive

Environmental Data

Reliability Test Result

Manufacturing Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Export Regulations

Export Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Taping Information

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Package Dimensions

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

SOP8 Dual Cu Inner Structure

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article