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8-VSSOP
Integrated Circuits (ICs)

THS4505DGK

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Texas Instruments

WIDEBAND, LOW-DISTORTION FULLY DIFFERENTIAL AMPLIFIER

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8-VSSOP
Integrated Circuits (ICs)

THS4505DGK

Active
Texas Instruments

WIDEBAND, LOW-DISTORTION FULLY DIFFERENTIAL AMPLIFIER

Technical Specifications

Parameters and characteristics for this part

SpecificationTHS4505DGK
-3db Bandwidth260 MHz
Amplifier TypeDifferential
Current - Input Bias4 µA
Current - Output / Channel130 mA
Current - Supply16 mA
Gain Bandwidth Product210 MHz
Mounting TypeSurface Mount
Number of Circuits1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output TypeDifferential
Package / Case8-MSOP, 8-TSSOP
Package / Case3 mm
Package / Case [custom]0.118 in
Slew Rate1800 V/µs
Voltage - Input Offset4 mV
Voltage - Supply Span (Max) [Max]15 V
Voltage - Supply Span (Min) [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 240$ 4.08
Texas InstrumentsTUBE 1$ 5.55
100$ 4.52
250$ 3.56
1000$ 3.02

Description

General part information

THS4505 Series

The THS4504 and THS4505 are high-performance, fully differential amplifiers from Texas Instruments. The THS4504, featuring power-down capability, and the THS4505, without power-down capability, set new performance standards for fully differential amplifiers with unsurpassed linearity, supporting 12-bit operation through 40 MHz. Package options include the SOIC-8 and the MSOP-8 with PowerPAD for a smaller footprint, enhanced ac performance, and improved thermal dissipation capability.

The THS4504 and THS4505 are high-performance, fully differential amplifiers from Texas Instruments. The THS4504, featuring power-down capability, and the THS4505, without power-down capability, set new performance standards for fully differential amplifiers with unsurpassed linearity, supporting 12-bit operation through 40 MHz. Package options include the SOIC-8 and the MSOP-8 with PowerPAD for a smaller footprint, enhanced ac performance, and improved thermal dissipation capability.