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Discrete Semiconductor Products

HP8M51TB1

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Rohm Semiconductor

TRANS MOSFET N/P-CH 100V 4.5A 8-PIN HSOP EP T/R

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Product thumbnail image
Discrete Semiconductor Products

HP8M51TB1

Active
Rohm Semiconductor

TRANS MOSFET N/P-CH 100V 4.5A 8-PIN HSOP EP T/R

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationHP8M51TB1
ConfigurationN and P-Channel
Current - Continuous Drain (Id) @ 25°C4.5 A
Drain to Source Voltage (Vdss)100 V
Gate Charge (Qg) (Max) @ Vgs15 nC, 26.2 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]1430 pF
Input Capacitance (Ciss) (Max) @ Vds [Min]600 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerTDFN
Power - Max3 W
Rds On (Max) @ Id, Vgs170 mOhm, 290 mOhm
Supplier Device Package8-HSOP
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.23
10$ 1.85
100$ 1.47
500$ 1.25
1000$ 1.06
Digi-Reel® 1$ 2.23
10$ 1.85
100$ 1.47
500$ 1.25
1000$ 1.06
N/A 635$ 2.94
Tape & Reel (TR) 2500$ 1.00
5000$ 0.97

Description

General part information

HP8M51 Series

100V Nch+Pch Power MOSFET

Documents

Technical documentation and resources

Inner Structure

Package Information

About Export Regulations

Export Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Compliance of the RoHS directive

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

P-channel Power MOSFETs selection guide

Technical Article

Anti-Whisker formation - Transistors

Package Information

PCB Layout Thermal Design Guide

Thermal Design

HP8M51 ESD Data

Characteristics Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

HSOP8(Symmetry Dual) Condition of Soldering / Land Pattern Reference

Package Information

Part Explanation

Application Note

What Is Thermal Design

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Types and Features of Transistors

Application Note

Moisture Sensitivity Level - Transistors

Package Information

Explanation for Marking

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Package Dimensions

Package Information

How to Create Symbols for PSpice Models

Models

HP8M51 Data Sheet

Data Sheet

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Taping Information

Package Information