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Discrete Semiconductor Products

RRS100P03HZGTB

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Rohm Semiconductor

PCH -30V -10A POWER MOSFET. RRS1

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Discrete Semiconductor Products

RRS100P03HZGTB

Active
Rohm Semiconductor

PCH -30V -10A POWER MOSFET. RRS1

Technical Specifications

Parameters and characteristics for this part

SpecificationRRS100P03HZGTB
Current - Continuous Drain (Id) @ 25°C10 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]39 nC
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds [Max]3600 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Power Dissipation (Max)2 W
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs12.6 mOhm
Supplier Device Package8-SOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.78
10$ 1.79
100$ 1.24
500$ 0.99
1000$ 0.92
Digi-Reel® 1$ 2.78
10$ 1.79
100$ 1.24
500$ 0.99
1000$ 0.92
N/A 1200$ 2.54
Tape & Reel (TR) 2500$ 0.82

Description

General part information

RRS100 Series

RRS100P03HZG is an automotive grade MOSFET that is AEC-Q101 qualified. A Pch -30V MOSFET with ESD protection diode is included in the SOP8 package. Ideal for switching applications.

Documents

Technical documentation and resources

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Types and Features of Transistors

Application Note

PCB Layout Thermal Design Guide

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Flammability of Materials

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Anti-Whisker formation - Transistors

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Explanation for Marking

Package Information

About Export Regulations

Export Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

What Is Thermal Design

Thermal Design

RRS100P03HZG ESD Data

Characteristics Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

RRS100P03HZG Data Sheet

Data Sheet

What is a Thermal Model? (Transistor)

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice&reg; Models

Schematic Design & Verification

Package Dimensions

Package Information

Reliability Test Result

Manufacturing Data

Compliance of the RoHS directive

Environmental Data

Taping Information

Package Information

Part Explanation

Application Note