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RU1C002UNTCL
Discrete Semiconductor Products

RU1C002UNTCL

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Rohm Semiconductor

MOSFET N-CH 20V 200MA UMT3F

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RU1C002UNTCL
Discrete Semiconductor Products

RU1C002UNTCL

Active
Rohm Semiconductor

MOSFET N-CH 20V 200MA UMT3F

Technical Specifications

Parameters and characteristics for this part

SpecificationRU1C002UNTCL
Current - Continuous Drain (Id) @ 25°C200 mA
Drain to Source Voltage (Vdss)20 V
Drive Voltage (Max Rds On, Min Rds On)1.2 V, 2.5 V
FET TypeN-Channel
Input Capacitance (Ciss) (Max) @ Vds25 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-85
Power Dissipation (Max) [Max]150 mW
Rds On (Max) @ Id, Vgs1.2 Ohm
Supplier Device PackageUMT3F
TechnologyMOSFET (Metal Oxide)
Vgs (Max) [Max]8 V
Vgs(th) (Max) @ Id1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1670$ 0.32

Description

General part information

RU1C002UN Series

MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobile equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.

Documents

Technical documentation and resources

How to Use LTspice® Models

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Taping Information

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Anti-Whisker formation - Transistors

Package Information

ESD Data

Characteristics Data

Method for Monitoring Switching Waveform

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Export Regulations

Export Information

How to Create Symbols for PSpice Models

Models

List of Transistor Package Thermal Resistance

Thermal Design

Package Dimensions

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

About Flammability of Materials

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Explanation for Marking

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What Is Thermal Design

Thermal Design

RU1C002UN Data Sheet

Data Sheet

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Part Explanation

Application Note

Inner Structure

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Types and Features of Transistors

Application Note

Compliance of the RoHS directive

Environmental Data