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BC857BU3T106
Discrete Semiconductor Products

BC857BU3T106

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Rohm Semiconductor

BIPOLAR TRANSISTORS - BJT PNP GENERAL PURPOSE TRANSISTOR. BC857BU3 IS BIPOLAR TRANSISTOR FOR AUDIO FREQUENCY SMALL SIGNAL AMPLIFIER.

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BC857BU3T106
Discrete Semiconductor Products

BC857BU3T106

Active
Rohm Semiconductor

BIPOLAR TRANSISTORS - BJT PNP GENERAL PURPOSE TRANSISTOR. BC857BU3 IS BIPOLAR TRANSISTOR FOR AUDIO FREQUENCY SMALL SIGNAL AMPLIFIER.

Technical Specifications

Parameters and characteristics for this part

SpecificationBC857BU3T106
Current - Collector (Ic) (Max) [Max]100 mA
Current - Collector Cutoff (Max) [Max]15 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]210
Frequency - Transition250 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-323, SC-70
Power - Max [Max]200 mW
Supplier Device PackageUMT3
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic0.65 V
Voltage - Collector Emitter Breakdown (Max) [Max]45 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 0.27
MouserN/A 1$ 0.27
10$ 0.17
100$ 0.10
500$ 0.08
1000$ 0.07
3000$ 0.06
6000$ 0.05
9000$ 0.04
24000$ 0.04
NewarkEach (Supplied on Cut Tape) 1$ 0.28
10$ 0.17
25$ 0.15
50$ 0.13
100$ 0.11
250$ 0.09
500$ 0.08
1000$ 0.07

Description

General part information

BC857BU3 Series

BC857BU3 is bipolar transistor for audio frequency small signal amplifier

Documents

Technical documentation and resources

BC857BU3T106 Datasheet (PDF)

Datasheet

Technical Data Sheet EN

Datasheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What Is Thermal Design

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

About Export Regulations

Export Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Flammability of Materials

Environmental Data

Compliance of the RoHS directive

Environmental Data

Types and Features of Transistors

Application Note

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Explanation for Marking

Package Information

PCB Layout Thermal Design Guide

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Package Dimensions

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Anti-Whisker formation - Transistors

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Part Explanation

Application Note

Taping Information

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design