
IRFB38N20DPBF
ActivePOWER MOSFET, N CHANNEL, 200 V, 43 A, 0.054 OHM, TO-220AB, THROUGH HOLE
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IRFB38N20DPBF
ActivePOWER MOSFET, N CHANNEL, 200 V, 43 A, 0.054 OHM, TO-220AB, THROUGH HOLE
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Technical Specifications
Parameters and characteristics for this part
| Specification | IRFB38N20DPBF |
|---|---|
| Current - Continuous Drain (Id) @ 25°C | 43 A |
| Drain to Source Voltage (Vdss) | 200 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Qg) (Max) @ Vgs | 91 nC |
| Input Capacitance (Ciss) (Max) @ Vds | 2900 pF |
| Mounting Type | Through Hole |
| Operating Temperature [Max] | 175 °C |
| Operating Temperature [Min] | -55 °C |
| Package / Case | TO-220-3 |
| Power Dissipation (Max) | 3.8 W, 300 W |
| Rds On (Max) @ Id, Vgs | 54 mOhm |
| Supplier Device Package | TO-220AB |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) @ Id | 5 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 189 | $ 1.59 | |
| 189 | $ 1.59 | |||
| 226 | $ 1.33 | |||
| 226 | $ 1.33 | |||
| N/A | 185 | $ 3.39 | ||
| 185 | $ 3.39 | |||
| 3340 | $ 1.91 | |||
| 3340 | $ 1.91 | |||
| Tube | 1 | $ 2.74 | ||
| 1 | $ 2.74 | |||
| 50 | $ 2.20 | |||
| 50 | $ 2.20 | |||
| 100 | $ 1.81 | |||
| 100 | $ 1.81 | |||
| 500 | $ 1.53 | |||
| 500 | $ 1.53 | |||
| 1000 | $ 1.30 | |||
| 1000 | $ 1.30 | |||
| 2000 | $ 1.23 | |||
| 2000 | $ 1.23 | |||
| 5000 | $ 1.19 | |||
| 5000 | $ 1.19 | |||
| Newark | Each | 1 | $ 3.29 | |
| 10 | $ 2.00 | |||
| 100 | $ 1.81 | |||
| 500 | $ 1.52 | |||
| 1000 | $ 1.42 | |||
| 3000 | $ 1.37 | |||
| 5000 | $ 1.36 | |||
Description
General part information
IRFB38 Series
The IR MOSFET family of power MOSFETs utilizes proven silicon processes offering designers a wide portfolio of devices to support various applications such as DC motors, inverters, SMPS, lighting, load switches as well as battery powered applications.The devices are available in a variety of surface mount and through-hole packages with industry standard footprints for ease of design.
Documents
Technical documentation and resources