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ROHM HT8KB5TB1
Discrete Semiconductor Products

HT8KC6TB1

Active
Rohm Semiconductor

MOSFET, DUAL, N-CH, 60 V, 15A, 14W, HSMT ROHS COMPLIANT: YES

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Search across all available documentation for this part.

DocumentsMethod for Monitoring Switching WaveformTypes and Features of Transistors+35
ROHM HT8KB5TB1
Discrete Semiconductor Products

HT8KC6TB1

Active
Rohm Semiconductor

MOSFET, DUAL, N-CH, 60 V, 15A, 14W, HSMT ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsMethod for Monitoring Switching WaveformTypes and Features of Transistors+35

Technical Specifications

Parameters and characteristics for this part

SpecificationHT8KC6TB1
Configuration2 N-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C15 A, 6.5 A
Drain to Source Voltage (Vdss)60 V
Gate Charge (Qg) (Max) @ Vgs [Max]7.6 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]460 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerVDFN
Power - Max2 W, 14 W
Rds On (Max) @ Id, Vgs29 mOhm
Supplier Device Package [custom]8-HSMT
Supplier Device Package [x]3.2
Supplier Device Package [y]3
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2659$ 2.12
NewarkEach (Supplied on Cut Tape) 1$ 1.96
10$ 1.36
25$ 1.22
50$ 1.09
100$ 0.96
250$ 0.83
500$ 0.76
1000$ 0.69

Description

General part information

HT8KC6 Series

HT8KC6 is a low on-resistance MOSFET ideal for switching applications.

Documents

Technical documentation and resources

Method for Monitoring Switching Waveform

Schematic Design & Verification

Types and Features of Transistors

Application Note

List of Transistor Package Thermal Resistance

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

HSMT8 Explanation for Marking

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Taping Information - TR-HSMT8(TB1)

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

HT8KC6 ESD Data

Characteristics Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Export Regulations

Export Information

About Flammability of Materials

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Inner Structure

Package Information

P-channel Power MOSFETs selection guide

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

Package Dimensions

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Compliance of the RoHS directive

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Anti-Whisker formation - Transistors

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Part Explanation

Application Note

HT8KC6 Data Sheet

Data Sheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design