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ONSEMI SMUN5211T1G
Discrete Semiconductor Products

RQ5L015SPTL

Active
Rohm Semiconductor

POWER MOSFET, P CHANNEL, 60 V, 1.5 A, 0.2 OHM, TSMT, SURFACE MOUNT

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ONSEMI SMUN5211T1G
Discrete Semiconductor Products

RQ5L015SPTL

Active
Rohm Semiconductor

POWER MOSFET, P CHANNEL, 60 V, 1.5 A, 0.2 OHM, TSMT, SURFACE MOUNT

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ5L015SPTL
Current - Continuous Drain (Id) @ 25°C1.5 A
Drain to Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs10 nC
Input Capacitance (Ciss) (Max) @ Vds500 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSC-96
Power Dissipation (Max)1 W
Rds On (Max) @ Id, Vgs [Max]280 mOhm
Supplier Device PackageTSMT3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 4448$ 0.45
NewarkEach (Supplied on Cut Tape) 1$ 0.48
10$ 0.39
25$ 0.35
50$ 0.31
100$ 0.28
250$ 0.24

Description

General part information

RQ5L015SP Series

Middle Power MOSFET RQ5L015SP is suitable for switching power supply.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

P-channel Power MOSFETs selection guide

Technical Article

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Taping Information

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Part Explanation

Application Note

Compliance of the RoHS directive

Environmental Data

Package Dimensions

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Explanation for Marking

Package Information

Moisture Sensitivity Level - Transistors

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Export Regulations

Export Information

Anti-Whisker formation - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Inner Structure

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

About Flammability of Materials

Environmental Data

Types and Features of Transistors

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

ESD Data

Characteristics Data

Reliability Test Result

Manufacturing Data

How to Create Symbols for PSpice Models

Models

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article