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Texas Instruments-TPS2010DRG4 Power Switches Power Switch Hi Side 1-OUT 0A 140mOhm 8-Pin SOIC T/R
Discrete Semiconductor Products

TPS1100DR

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Texas Instruments

TRANS MOSFET P-CH SI 15V 1.6A 8-PIN SOIC T/R

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Texas Instruments-TPS2010DRG4 Power Switches Power Switch Hi Side 1-OUT 0A 140mOhm 8-Pin SOIC T/R
Discrete Semiconductor Products

TPS1100DR

Active
Texas Instruments

TRANS MOSFET P-CH SI 15V 1.6A 8-PIN SOIC T/R

Technical Specifications

Parameters and characteristics for this part

SpecificationTPS1100DR
Current - Continuous Drain (Id) @ 25°C1.6 A
Drain to Source Voltage (Vdss)15 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 2.7 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]5.45 nC
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Package / Case8-SOIC
Package / Case [x]0.154 in
Package / Case [y]3.9 mm
Power Dissipation (Max)791 mW
Rds On (Max) @ Id, Vgs180 mOhm
Supplier Device Package8-SOIC
TechnologyMOSFET (Metal Oxide)
Vgs (Max) [Max]2 V
Vgs (Max) [Min]-15 V
Vgs(th) (Max) @ Id1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.62
10$ 1.32
100$ 1.03
500$ 0.87
1000$ 0.71
Digi-Reel® 1$ 1.62
10$ 1.32
100$ 1.03
500$ 0.87
1000$ 0.71
Tape & Reel (TR) 2500$ 0.67
5000$ 0.64
12500$ 0.61
Texas InstrumentsLARGE T&R 1$ 1.25
100$ 1.03
250$ 0.74
1000$ 0.56

Description

General part information

TPS1100 Series

The TPS1100 is a single P-channel enhancement-mode MOSFET. The device has been optimized for 3-V or 5-V power distribution in battery-powered systems by means of Texas Instruments LinBiCMOSTMprocess. With a maximum VGS(th)of -1.5 V and an IDSSof only 0.5 uA, the TPS1100 is the ideal high-side switch for low-voltage, portable battery-management systems where maximizing battery life is a primary concern. The low rDS(on)and excellent ac characteristics (rise time 10 ns typical) make the TPS1100 the logical choice for low-voltage switching applications such as power switches for pulse-width-modulated (PWM) controllers or motor/bridge drivers.

The ultrathin thin shrink small-outline package or TSSOP (PW) version with its smaller footprint and reduction in height fits in places where other P-channel MOSFETs cannot. The size advantage is especially important where board real estate is at a premium and height restrictions do not allow for a small-outline integrated circuit (SOIC) package.

Such applications include notebook computers, personal digital assistants (PDAs), cellular telephones, and PCMCIA cards. For existing designs, the D-packaged version has a pinout common with other p-channel MOSFETs in SOIC packages.