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Technical Specifications
Parameters and characteristics for this part
| Specification | FSB50760SF |
|---|---|
| Configuration | 3 Phase |
| Current | 3.6 A |
| Mounting Type | Through Hole |
| Package / Case | 23-PowerDIP Module |
| Package / Case | 0.573 in |
| Package / Case | 14.56 mm |
| Type | MOSFET |
| Voltage | 600 V |
| Voltage - Isolation | 1500 VAC |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 40 | $ 7.60 | |
Description
General part information
FSB50760SF Series
FSB50760SF and FSB50760SFT are a Motion SPM5 SuperFET Series Based on Super Junction MOSFET (SuperFET) Technology as a Compact Inverter Solution for Small Power Motor Drive Applications Such as Refrigerators, Fans and Pumps. FSB50760SF and FSB50760SFT Contains Six SuperFET MOSFETs, Three Half-Bridge Gate Drive HVICs with Temperature Sensing, and Three Bootstrap Diodes in a Compact Package Fully Isolated and Optimized for Thermal Performance. Esoecially, Adopted SuperFET MOSFETs Have Fast Trr Characteristics for Body-Diode. FSB50-760SF and FSB50760SFT Features Low Electromagnetic Interference(EMI) Characteristics Through Optimizing Switching Speed and Reducing Parasitic Inductance. Since FSB50760SF and FSB50760SFT Employs MOSFETs as Power Switches, It Povides Much More Ruggedness and Larger Safe Operating Area (SOA) than IGBT-Based Power Modules. FSB50760SF and FSB50760SFT are the Right Solution for Compact and Reliable Inverter Designs Where the Assembly Space is Constrained.
Documents
Technical documentation and resources