Soldering, Desoldering, Rework Products

4860P-35G

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SOLDER LEADED SOLDER PASTE SN63/PB37, NO CLEAN

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Soldering, Desoldering, Rework Products

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SOLDER LEADED SOLDER PASTE SN63/PB37, NO CLEAN

Technical Specifications

Parameters and characteristics for this part

Specification	4860P-35G

Flux Type	No-Clean
Form	1.23 oz, 10 cc
Form	35 g
Form	Syringe
Melting Point	361 °F
Mesh Type	3
Process	Leaded
Shelf Life	24 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature [Max]	10 °C
Storage/Refrigeration Temperature [Max]	10 °C
Storage/Refrigeration Temperature [Min]	39 °F
Storage/Refrigeration Temperature [Min]	4 °C
Type	Solder Paste

Part	Flux Type	Form	Form	Form	Mesh Type	Melting Point	Type	Shelf Life	Process	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Max]	Shelf Life Start
MG Chemicals 4860P-35G	No-Clean	1.23 oz 10 cc	35 g	Syringe	3	361 °F	Solder Paste	24 Months	Leaded	39 °F	4 °C	10 °C	10 °C	Date of Manufacture

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General part information

SOLDER LEADED SOLDER PASTE SN63/PB37, NO CLEAN

Technical documentation and resources