Zenode.ai Logo
Beta

Technical Specifications

Parameters and characteristics for this part

SpecificationDS25BR150TSD/NOPB
ApplicationsLVDS
Current - Supply27 mA
Delay Time350 ps
Mounting TypeSurface Mount
Number of Channels1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
OutputLVDS
Package / Case8-WFDFN Exposed Pad
Supplier Device Package8-WSON (3x3)
TypeReDriver, Buffer
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 4.80
10$ 4.32
25$ 4.08
100$ 3.54
250$ 3.35
500$ 3.01
Digi-Reel® 1$ 4.80
10$ 4.32
25$ 4.08
100$ 3.54
250$ 3.35
500$ 3.01
Tape & Reel (TR) 1000$ 2.54
2000$ 2.41
Texas InstrumentsSMALL T&R 1$ 3.30
100$ 2.69
250$ 2.12
1000$ 1.79

Description

General part information

DS25BR150 Series

The DS25BR150 is a single channel 3.125 Gbps LVDS buffer optimized for high-speed signal transmission over printed circuit boards and balanced cables. Fully differential signal paths ensure exceptional signal integrity and noise immunity.

The DS25BR150 is a buffer/repeater with very low power consumption. Other LVDS devices with similar IO characteristics and with signal conditioning features include the following products. The DS25BR110 features four levels of equalization for use as an optimized receiver device, the DS25BR120 features four levels of pre-emphasis for use as an optimized driver device, and the DS25BR100 features both pre-emphasis and equalization for use as an optimized repeater device.

Wide input common mode range allows the receiver to accept signals with LVDS, CML and LVPECL levels; the output levels are LVDS. A very small package footprint requires a minimal space on the board while the flow-through pinout allows easy board layout. The differential inputs and outputs are internally terminated with a 100Ω resistor to lower device input and output return losses, reduce component count, and further minimize board space.