Connectors, Interconnects

232-1287-00-0602J

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3M Electronic Specialty

IC & COMPONENT SOCKET, 32 CONTACTS, DIP SOCKET, 2.54 MM, 11.43 MM, BERYLLIUM COPPER

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DocumentsTechnical Data Sheet EN

Connectors, Interconnects

232-1287-00-0602J

Active

3M Electronic Specialty

IC & COMPONENT SOCKET, 32 CONTACTS, DIP SOCKET, 2.54 MM, 11.43 MM, BERYLLIUM COPPER

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DocumentsTechnical Data Sheet EN

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	232-1287-00-0602J

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	15 mOhm
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polysulfone (PSU), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Connector
Number of Positions or Pins (Grid)	32
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Press-Fit
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	ZIF (ZIP), DIP
Type	0.6 " (15.24mm) Row Spacing

232 Series

Part	Shelf Life	Shelf Life Start	Storage/Refrigeration Temperature	Storage/Refrigeration Temperature	Thickness	Thickness	Thickness	Usage	Adhesive	Width [custom]	Width [custom]	Backing, Carrier	Tape Type	Color	Length	Length	Length	Material Flammability Rating	Current Rating (Amps)	Contact Resistance	Termination Post Length	Termination Post Length	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Post	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Housing Material	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Finish - Mating	Termination Post Length	Width	Width	Type	Width [x]	Width [x]	Number of Positions or Pins (Grid) [custom]
3M Electronic Specialty 232-48MM-55M	12 Months	Date of Manufacture	70 °F	21 °C	0.16 mm	0.0063 in	6.3 mils	Paint Bake Medium Temp	Rubber	1.89 in	48 mm	Crepe Paper Treated	Masking	Tan	60 yds	55 m	180 ft
3M Electronic Specialty 232-1270-01-0602																		UL94 V-0	1 A	25 mOhm	0.154 in	3.9 mm	Solder	-55 C	125 °C	Gold	Beryllium Copper	30 µin	0.76 µm	PGA ZIF (ZIP)	0.76 Ám	30 Áin	Closed Frame	0.1 in	2.54 mm	32	Polysulfone (PSU) Glass Filled	Beryllium Copper	0.1 "	2.54 mm	Through Hole	Gold
3M Electronic Specialty 232-5205-01																				25 mOhm		0.114 "	Solder			Gold	Beryllium Copper			QFN			Closed Frame			32	Polyethersulfone (PES)	Beryllium Copper			Through Hole	Gold	2.9 mm
3M Electronic Specialty 232-36MMX55M	12 Months	Date of Manufacture	70 °F	21 °C	0.16 mm	0.0063 in	6.3 mils	Paint Bake Medium Temp	Rubber			Crepe Paper Treated	Masking	Tan	60 yds	55 m	180 ft																											1.42 in	36 mm
3M Electronic Specialty 232-1270-02-0602																		UL94 V-0	1 A	25 mOhm	0.154 in	3.9 mm	Solder	-55 C	125 °C	Gold	Beryllium Copper	30 µin	0.76 µm	PGA ZIF (ZIP)	0.76 Ám	30 Áin	Closed Frame	0.1 in	2.54 mm	32	Polysulfone (PSU) Glass Filled	Beryllium Copper	0.1 "	2.54 mm	Through Hole	Gold
3M Electronic Specialty 232-1287-00-0602J																		UL94 V-0	1 A	15 mOhm	0.11 in	2.78 mm	Press-Fit	-55 C	125 °C	Gold	Beryllium Copper	30 µin	0.76 µm	DIP ZIF (ZIP)	0.76 Ám	30 Áin	Closed Frame	0.1 in	2.54 mm	32	Polysulfone (PSU) Glass Filled	Beryllium Copper	0.1 "	2.54 mm	Connector	Gold				0.6 " (15.24mm) Row Spacing
3M Electronic Specialty 232-1271-00-1102JH																				25 mOhm
3M Electronic Specialty 232-96MMX55M	12 Months	Date of Manufacture	70 °F	21 °C	0.16 mm	0.0063 in	6.3 mils	Paint Bake Medium Temp	Rubber			Crepe Paper Treated	Masking	Tan	60 yds	55 m	180 ft																														3.78 in	96 mm
3M Electronic Specialty 232-2601-00-0602																		UL94 V-0	1 A		0.13 in	3.3 mm	Solder	-55 C	125 °C	Gold	Beryllium Copper	30 µin	0.76 µm	SIP ZIF (ZIP)				0.1 in	2.54 mm	32	Polysulfone (PSU) Glass Filled	Beryllium Copper	0.1 "	2.54 mm	Through Hole	Gold							1 x 32
3M Electronic Specialty 232-1285-00-0602J																		UL94 V-0	1 A		0.11 in	2.78 mm	Press-Fit	-55 C	125 °C	Gold	Beryllium Copper	30 µin	0.76 µm	DIP ZIF (ZIP)	0.76 Ám	30 Áin	Closed Frame	0.1 in	2.54 mm	32	Polysulfone (PSU) Glass Filled	Beryllium Copper	0.1 "	2.54 mm	Connector	Gold				0.6 " (15.24mm) Row Spacing

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 42.75
		10	$ 37.44
		30	$ 35.82
		50	$ 34.67
		100	$ 33.51
		250	$ 31.66
	N/A	0	$ 42.57

Description

General part information

232 Series

32 (2 x 16) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Gold Connector

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet