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RUC002N05T116
Discrete Semiconductor Products

BSS84AHZGT116

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Rohm Semiconductor

PCH -60V -0.23A, SOT-23, SMALL SIGNAL MOSFET FOR AUTOMOTIVE

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RUC002N05T116
Discrete Semiconductor Products

BSS84AHZGT116

Active
Rohm Semiconductor

PCH -60V -0.23A, SOT-23, SMALL SIGNAL MOSFET FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationBSS84AHZGT116
Current - Continuous Drain (Id) @ 25°C230 mA
Drain to Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeP-Channel
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds [Max]34 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-3, TO-236-3, SC-59
Power Dissipation (Max)200 mW
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs5.3 Ohm
Supplier Device PackageSST3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.48
10$ 0.29
100$ 0.18
500$ 0.14
1000$ 0.12
Digi-Reel® 1$ 0.48
10$ 0.29
100$ 0.18
500$ 0.14
1000$ 0.12
N/A 2329$ 0.47
Tape & Reel (TR) 3000$ 0.10
6000$ 0.09
9000$ 0.09
15000$ 0.08
21000$ 0.08
30000$ 0.08
75000$ 0.07

Description

General part information

BSS84 Series

BSS84AHZG is Single Pch -60V -0.23A MOSFET and ESD protection diode are included in the industry’s favorite SOT-23 package. Ideal for switching circuit and high-side load switch, relay driver applications. This is a high-reliability product of automotive grade qualified to AEC-Q101.

Documents

Technical documentation and resources

PCB Layout Thermal Design Guide

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Package Dimensions

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

BSS84AHZG Data Sheet

Data Sheet

Moisture Sensitivity Level - Transistors

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Explanation for Marking

Package Information

Taping Information

Package Information

What Is Thermal Design

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Reliability Test Result

Manufacturing Data

Condition of Soldering / Land Pattern Reference

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Part Explanation

Application Note

About Flammability of Materials

Environmental Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Types and Features of Transistors

Application Note

About Export Regulations

Export Information

How to Use LTspice&reg; Models

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design