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28-HTSSOP
Integrated Circuits (ICs)

TPA6030A4PWP

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Texas Instruments

3-W, STEREO, 7.0- TO 15.0- V, ANALOG INPUT CLASS-AB AUDIO AMPLIFIER

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28-HTSSOP
Integrated Circuits (ICs)

TPA6030A4PWP

Active
Texas Instruments

3-W, STEREO, 7.0- TO 15.0- V, ANALOG INPUT CLASS-AB AUDIO AMPLIFIER

Technical Specifications

Parameters and characteristics for this part

SpecificationTPA6030A4PWP
FeaturesInput Multiplexer, Shutdown, Volume Control, Differential Inputs, Depop
Max Output Power x Channels @ Load5 W
Max Output Power x Channels @ Load [custom]16 Ohm
Max Output Power x Channels @ Load [x]2
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output Type2-Channel (Stereo) with Stereo Headphones
Package / Case28-PowerTSSOP
Package / Case [custom]4.4 mm
Package / Case [custom]0.173 "
Supplier Device Package28-HTSSOP
TypeClass AB
Voltage - Supply [Max]15 V
Voltage - Supply [Min]7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 4.48
10$ 4.02
50$ 3.80
100$ 3.30
250$ 3.13
500$ 2.98
Texas InstrumentsTUBE 1$ 4.81
100$ 4.21
250$ 2.96
1000$ 2.38

Description

General part information

TPA6030A4 Series

The TPA6030A4 is designed to drive 3 W into 16-speakers using a surface-mount package without the need for an external heatsink. These features make it ideal for 15" – 17" LCD monitors, small multimedia speakers, and notebook computers.

To simplify system design, the speaker volume level is adjusted by applying a dc voltage to the VOLUME terminal. The delta between speaker volume and headphone volume can be adjusted by applying a dc voltage to the SEDIFF terminal. To avoid an unexpected high volume level through the headphones, a third terminal, SEMAX, limits the headphone volume level when a dc voltage is applied. Integrated depop circuitry and the fully differential design minimize pops, clicks, and unwanted noise to provide a high level of audio performance.

The device is available in a 28-pin TSSOP PowerPAD™ package. The PowerPAD™ package is designed to transfer heat into the ground plane, eliminating the need for external heat sinks—minimizing solution cost and size.