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RB068L100DDTE25
Discrete Semiconductor Products

RSX301L-30TE25

NRND
Rohm Semiconductor

HIGH EFFICIENCY , HIGH RELIABILITY TYPE SCHOTTKY BARRIER DIODE

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsAbsolute Maximum Rating and Electrical Characteristics of DiodesReliability Test Result+32
RB068L100DDTE25
Discrete Semiconductor Products

RSX301L-30TE25

NRND
Rohm Semiconductor

HIGH EFFICIENCY , HIGH RELIABILITY TYPE SCHOTTKY BARRIER DIODE

Deep-Dive with AI

DocumentsAbsolute Maximum Rating and Electrical Characteristics of DiodesReliability Test Result+32

Technical Specifications

Parameters and characteristics for this part

SpecificationRSX301L-30TE25
Current - Average Rectified (Io)3 A
Current - Reverse Leakage @ Vr200 µA
Mounting TypeSurface Mount
Operating Temperature - Junction150 °C
Package / CaseDO-214AC, SMA
Speed200 mA, 500 ns
Supplier Device PackagePMDS
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]30 V
Voltage - Forward (Vf) (Max) @ If420 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.79
10$ 0.49
100$ 0.32
500$ 0.24
Digi-Reel® 1$ 0.79
10$ 0.49
100$ 0.32
500$ 0.24
Tape & Reel (TR) 1500$ 0.20
3000$ 0.19
4500$ 0.18
7500$ 0.17
10500$ 0.16
15000$ 0.15
37500$ 0.14
NewarkEach 1$ 0.28
10$ 0.26
100$ 0.23
500$ 0.21
1000$ 0.20
3000$ 0.19
10500$ 0.18

Description

General part information

RSX301LAM30TF Series

RSX301LAM30TF is a schottky barrier diode with low VFand Low IR, suitable for general rectification. It is a highly reliable product for automotive.

Documents

Technical documentation and resources

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Reliability Test Result

Manufacturing Data

What is a Thermal Model? (Diode)

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What Is Thermal Design

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

ESD Data

Characteristics Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Taping Information

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Diode Types and Applications

Technical Article

About Export Regulations

Export Information

Explanation for Marking

Package Information

Constitution Materials List

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

Part Explanation

Application Note

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Inner Structure

Package Information

RSX301L-30 Data Sheet

Data Sheet

How to Create Symbols for PSpice Models

Models

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information

How to Select Rectifier Diodes

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information