CSD97376Q4M
Active30 V 20 A SON 3.5 X 4.5 MM SYNCHRONOUS BUCK NEXFET™ POWER STAGE
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CSD97376Q4M
Active30 V 20 A SON 3.5 X 4.5 MM SYNCHRONOUS BUCK NEXFET™ POWER STAGE
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Technical Specifications
Parameters and characteristics for this part
| Specification | CSD97376Q4M |
|---|---|
| Applications | Synchronous Buck Converters |
| Current - Output / Channel [custom] | 20 A |
| Current - Peak Output | 45 A |
| Fault Protection | Shoot-Through, UVLO |
| Features | Bootstrap Circuit |
| Interface | PWM |
| Load Type | Inductive |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 150 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 8-PowerVFDFN |
| Supplier Device Package | 8-VSON (3.5x4.5) |
| Technology | Power MOSFET |
| Voltage - Load [Max] | 24 V |
| Voltage - Load [Min] | 4.5 V |
| Voltage - Supply [Max] | 5.5 V |
| Voltage - Supply [Min] | 4.5 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 2.06 | |
| 10 | $ 1.85 | |||
| 25 | $ 1.75 | |||
| 100 | $ 1.49 | |||
| 250 | $ 1.40 | |||
| 500 | $ 1.22 | |||
| 1000 | $ 1.01 | |||
| Digi-Reel® | 1 | $ 2.06 | ||
| 10 | $ 1.85 | |||
| 25 | $ 1.75 | |||
| 100 | $ 1.49 | |||
| 250 | $ 1.40 | |||
| 500 | $ 1.22 | |||
| 1000 | $ 1.01 | |||
| Tape & Reel (TR) | 2500 | $ 0.94 | ||
| 5000 | $ 0.91 | |||
| Texas Instruments | LARGE T&R | 1 | $ 1.55 | |
| 100 | $ 1.28 | |||
| 250 | $ 0.92 | |||
| 1000 | $ 0.69 | |||
Description
General part information
CSD97376Q4M Series
The CSD97376Q4M NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows™ 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5-mm × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
The CSD97376Q4M NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows™ 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5-mm × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
Documents
Technical documentation and resources