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ROHM DTC023YUBTL
Discrete Semiconductor Products

RSF014N03TL

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Rohm Semiconductor

TRANS MOSFET N-CH 30V 1.4A 3-PIN TUMT T/R

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ROHM DTC023YUBTL
Discrete Semiconductor Products

RSF014N03TL

Active
Rohm Semiconductor

TRANS MOSFET N-CH 30V 1.4A 3-PIN TUMT T/R

Technical Specifications

Parameters and characteristics for this part

SpecificationRSF014N03TL
Current - Continuous Drain (Id) @ 25°C1.4 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeN-Channel
Input Capacitance (Ciss) (Max) @ Vds [Max]70 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Rds On (Max) @ Id, Vgs [Max]240 mOhm
Supplier Device PackageTUMT3
TechnologyMOSFET (Metal Oxide)
Vgs (Max) [Max]20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3184$ 0.86
MouserN/A 1$ 0.79
10$ 0.55
100$ 0.37
500$ 0.28
1000$ 0.25
3000$ 0.22
6000$ 0.20
9000$ 0.19
NewarkEach (Supplied on Cut Tape) 1$ 0.92
10$ 0.58
25$ 0.51
50$ 0.45
100$ 0.38
250$ 0.34
500$ 0.29
1000$ 0.26

Description

General part information

RSF014N03 Series

Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Compliance of the RoHS directive

Environmental Data

Part Explanation

Application Note

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

ESD Data

Characteristics Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Explanation for Marking

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

About Flammability of Materials

Environmental Data

Taping Information

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Package Dimensions

Package Information

Anti-Whisker formation - Transistors

Package Information

Reliability Test Result

Manufacturing Data

List of Transistor Package Thermal Resistance

Thermal Design

RSF014N03 Data Sheet

Data Sheet

About Export Regulations

Export Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

What Is Thermal Design

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Inner Structure

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Types and Features of Transistors

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design